Investigations on brittle-ductile cutting transition and crack formation in diamond cutting of mono-crystalline silicon
Investigations on brittle-ductile cutting transition and crack formation in diamond cutting of mono-crystalline silicon
复制标题
单晶硅金刚石切削脆塑切削转变及裂纹形成研究
DOI：
10.1007/s00170-017-1108-1
复制
发表时间：
2018-03-01
影响因子：
3.4
通讯作者：
Wang, Minghai
中科院分区：
文献类型：
--
作者：
Liu, Haitao;Xie, Wenkun;Wang, Minghai
本文首先通过一系列的纳米压痕实验，获得了单晶硅的载荷-位移曲线。在此基础上，建立了单晶硅的材料本构模型。在此基础上，建立了单晶硅切削过程的有限元模型，并通过切削仿真得到了临界脆塑转变厚度。在超精密金刚石切割机上进行了飞切实验，分析了切割速度对脆塑转变厚度的影响，并对仿真结果进行了验证。最后，利用扩展单元法研究了单晶硅切削过程中裂纹的萌生和扩展机理，深入了解了切削裂纹对单晶硅脆塑转变的影响。
In this paper, the load-displacement curve of mono-crystalline silicon is first obtained by serials of nano-indentation experiments. Then, the material constitutive model of mono-crystalline silicon is developed. On this basis, a finite element method (FEM) model for the cutting process of mono-crystalline silicon is built and the critical brittle-ductile transition thickness is obtained by cutting simulations. Moreover, the fly-cut experiments on the ultra-precision diamond machine are performed to analyze the effect of cutting speeds on the brittle-ductile transition thicknesses, which are also used to validate the simulation results. Finally, by using extended element method, the mechanism of initiation and propagation of crack in the cutting process of mono-crystal silicon is studied and the effects of cut-induced cracks on the brittle-ductile transition of mono-crystalline silicon are deeply understood.