A Multi-modal Data Merging Framework for Correlative Investigation of Strain Localization in Three Dimensions
A Multi-modal Data Merging Framework for Correlative Investigation of Strain Localization in Three Dimensions
复制标题
三维应变定位相关研究的多模态数据合并框架
DOI：
10.1007/s11837-021-04894-6
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发表时间：
2021
期刊：
影响因子：
2.6
通讯作者：
T. Pollock
中科院分区：
文献类型：
--
作者：
M. Charpagne;J. Stinville;A. Polonsky;M. Echlin;T. Pollock
提出了一种多模态数据合并框架，可以在毫米尺度视场上重建三维滑移带。该技术将三维电子背散射衍射（EBSD）测量与扫描电子显微镜（SEM）收集的高分辨率数字图像相关（HR-DIC）信息相结合。典型的合并工作流程包括对应变场（滑移带、变形孪晶）和微观结构（晶粒）中的特征进行分割，利用局部晶体取向的知识，对数据集进行对齐，并将滑移带投影到3D微观结构中。该方法在面心立方镍基高温合金（FCC）和六方密实钛合金（HCP）两种材料中得到了验证。
A multi-modal data-merging framework that enables the reconstruction of slip bands in three dimensions over millimeter-scale fields of view is presented. The technique combines 3D electron back-scattered diffraction (EBSD) measurements with high-resolution digital image correlation (HR-DIC) information collected in the scanning electron microscope (SEM). A typical merging workflow involves the segmentation of features within the strain field (slip bands, deformation twins) and the microstructure (grains), alignment of datasets and the projection of slip bands into the 3D microstructure, using the knowledge of the local crystallographic orientation. This method is demonstrated in two materials: a face-centered cubic (FCC) nickel-base superalloy and hexagonal close-packed (HCP) titanium alloy.