Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer
Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer
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使用泡沫镍/锡复合中间层的铜合金超声波焊接
DOI：
10.1016/j.ultsonch.2018.03.005
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发表时间：
2018
影响因子：
8.4
通讯作者：
Zhu Xiaomeng
中科院分区：
文献类型：
--
作者：
Xiao Yong;Wang Qiwei;Wang Ling;Zeng Xian;Li Mingyu;Wang Ziqi;Zhang Xingyi;Zhu Xiaomeng
在本研究中，利用泡沫镍增强锡基复合焊料，在超声振动的辅助下，制备了铜合金接头。研究了超声波焊接时间对铜/镍-锡/铜接头组织和力学性能的影响。结果表明，采用自行研制的泡沫镍/锡复合焊料，在超声振动的辅助下可获得良好的冶金结合。对于5 S焊点，在铜衬底表面形成了(Cu，Ni)6Sn5金属间化合物层，Ni骨架在焊缝处随机分布，在Ni骨架表面形成了锯齿状的(Ni，Cu)3Sn4IMC层。在S焊接时间为20 时，(Ni，Cu)3Sn4IMC层显著长大，并在Ni骨架表面形成疏松的多孔结构。进一步延长钎焊时间至30 S，Ni骨架大量溶解在锡基焊料中，并在焊缝处形成微米级的(Ni，Cu)3Sn4颗粒并均匀分散。(Ni，Cu)3Sn4颗粒的形成主要归因于声空化引起的冲蚀和细化作用。S焊30 的接头剪切强度最高，为64.9 ± 3.3 Mpa，剪切破坏主要发生在焊缝处/铜衬底界面。
In this study, Cu alloy joints were fabricated with a Ni-foam reinforced Sn-based composite solder with the assistance of ultrasonic vibration. Effects of ultrasonic soldering time on the microstructure and mechanical properties of Cu/Ni-Sn/Cu joints were investigated. Results showed that exceptional metallurgic bonding could be acquired with the assistance of ultrasonic vibration using a self-developed Ni-foam/Sn composite solder. For joint soldered for 5 s, a (Cu,Ni)6Sn5intermetallic compound (IMC) layer was formed on the Cu substrate surface, Ni skeletons distributed randomly in the soldering seam and a serrated (Ni,Cu)3Sn4IMC layer was formed on the Ni skeleton surface. Increasing the soldering time to 20 s, the (Ni,Cu)3Sn4IMC layer grew significantly and exhibited a loose porous structure on the Ni skeleton surface. Further increase the soldering time to 30 s, Ni skeletons were largely dissolved in the Sn base solder, and micro-sized (Ni,Cu)3Sn4particles were formed and dispersed homogeneously in the soldering seam. The formation of (Ni,Cu)3Sn4particles was mainly ascribed to acoustic cavitations induced erosion and grain refining effects. The joint soldered for 30 s exhibited the highest shear strength of 64.9 ± 3.3 MPa, and the shearing failure mainly occurred at the soldering seam/Cu substrate interface.