Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: A Review
Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: A Review
复制标题
DOI：
10.1109/jsen.2014.2375203
复制
发表时间：
2015-06-01
影响因子：
4.3
通讯作者：
Dahiya, Ravinder S.
中科院分区：
文献类型：
--
作者：
Khan, Saleem;Lorenzelli, Leandro;Dahiya, Ravinder S.
由于低成本制造和在大面积上获得多功能电子器件的可能性，在柔性基板上印刷传感器和电子器件是一个非常感兴趣的领域。多年来，已经开发了许多印刷技术以在不同的基底上图案化各种电子材料。随着印刷技术在传感器和电子产品中的进一步扩展，现在是审查各种印刷技术的共同特征，互补性和挑战的时候了。本文介绍了各种印刷技术，常用的基板和电子材料进行了全面的审查。各种溶液/干式印刷和接触/非接触印刷技术已评估的基础上，技术，材料和工艺相关的发展领域。强调了各种印刷技术和潜在研究方向的关键挑战。已经探索了合并各种印刷方法的可能性，以将实验室开发的独立系统扩展到高速卷对卷生产线，以实现系统级集成。
Printing sensors and electronics over flexible substrates are an area of significant interest due to low-cost fabrication and possibility of obtaining multifunctional electronics over large areas. Over the years, a number of printing technologies have been developed to pattern a wide range of electronic materials on diverse substrates. As further expansion of printed technologies is expected in future for sensors and electronics, it is opportune to review the common features, the complementarities, and the challenges associated with various printing technologies. This paper presents a comprehensive review of various printing technologies, commonly used substrates and electronic materials. Various solution/dry printing and contact/noncontact printing technologies have been assessed on the basis of technological, materials, and process-related developments in the field. Critical challenges in various printing techniques and potential research directions have been highlighted. Possibilities of merging various printing methodologies have been explored to extend the lab developed standalone systems to high-speed roll-to-roll production lines for system level integration.