Toward Smart Surfaces Using High-Density Arrays of Silicon-Based Mechanical Oscillators
Toward Smart Surfaces Using High-Density Arrays of Silicon-Based Mechanical Oscillators
复制标题
使用高密度硅基机械振荡器阵列实现智能表面
DOI：
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发表时间：
1999
期刊：
影响因子：
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通讯作者：
H. Fujita
中科院分区：
文献类型：
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作者：
G. Bourbon;P. Minotti;Philippe Htlin;H. Fujita
长期以来，计算机芯片和其他电子产品一直在变得更快、更便宜。但是，经常被忽视的是，它们也在变得越来越小，从而使可穿戴式高科技在不久的将来得以开发。目前的小型化和集成化趋势将导致需要组装越来越小的系统，并处理越来越小的芯片和其他组件，这些组件将太小，人类无法操纵和组装。因此，未来电子组装行业的自动化基础设施将不得不随着技术的发展而扩大规模，使用机械手和智能运输系统等完全自动化的微型机器。因此，本文研究了快速而准确的定位系统，该系统将允许非常小的芯片和部件被输送和自动分拣。重点分析了硅基静电致动器的高密度阵列，根据它们以高速和亚微米级的定位精度在局部移动零件的能力。研究了高达1000个致动器/毫米的致动器密度，因此允许操纵微米级的硅基组件。为了在几厘米见方的运动表面上移动毫米尺寸的部件，还研究了涉及较大驱动单元的较低密度。最后讨论了迈向未来智能表面的第一步设计步骤。本文展示了阵列式硅基传感器如何能够提供来自外部世界的触觉信息，从而在不久的将来实现智能运输系统，这种传感器可以很容易地与阵列执行器一起分布。
Computer chips and other electronics have been getting faster and cheaper for a long time. But, often overlooked, they are also getting smaller and therefore allowing wearable high-technology to be developed on the near future. Current miniaturization and integration trends will result in the need to assemble ever-smaller systems and to handle smaller and smaller chips and other components that will be too small for humans to manipulate and assemble. As a consequence, the automation infrastructure of the future electronics assembly industry will have to scale with the technology, using fully and entirely automated micromachines such as manipulators and intelligent conveyance systems. The paper investigates, consequently, rapid and accurate positioning systems that will allow very small chips and components to be conveyed and automatically sorted. High-density arrays of silicon-based electrostatic actuators particularly are analyzed, according to their ability to move parts locally with high speed and sub-micrometer positioning accuracy. Actuator densities as high as 1000 actuators/mm are investigated, therefore allowing micrometer silicon based components to be manipulated. Lower densities involving larger actuation cells are also investigated in order to move millimeter size components on a few cm square motive surface. Very first design steps toward future smart surfaces are finally discussed. The paper shows how arrayed silicon based sensors, that can be easily distributed along with arrayed actuators, may provide tactile information from the external world, therefore allowing intelligent conveyance systems to be realized on the near future.