Optimization and comparison of double-layer and double-side micro-channel heat sinks with nanofluid for power electronics cooling
Optimization and comparison of double-layer and double-side micro-channel heat sinks with nanofluid for power electronics cooling
复制标题
电力电子冷却用纳米流体双层双面微通道散热器的优化与比较
DOI：
10.1016/j.applthermaleng.2014.01.005
复制
发表时间：
2014-04-01
影响因子：
6.4
通讯作者：
Leong, K. C.
中科院分区：
文献类型：
--
作者：
Sakanova, Assel;Yin, Shan;Leong, K. C.
随着电力电子系统功率的不断提高和体积的不断缩小，对热管理技术提出了更高的要求。将微通道热沉引入电力电子器件的冷却中，显著提高了电力电子器件的冷却性能。本文采用计算流体力学（CFD）方法，对两种先进的微通道结构，即以水为冷却剂的双层（DL）和双面（三明治）微通道结构进行了优化和比较。微通道集成在直接键合铜（DBC）的Cu层内。在几何优化过程中，研究了入口速度、入口温度、热流密度等参数对优化结果的影响。主要的标度效应包括温度相关的流体性质和入口效应。基于优化的几何形状，与单层（SL），DL与单向流和DL与逆流相比，具有逆流的夹层结构的热阻分别减少了59%，52%和53%。进一步应用水基Al2O3（浓度为1%和5%）纳米流体，对于宽通道显示出显著的改善。(C)2014爱思唯尔有限公司版权所有。
The tendency of increasing power rating and shrinking size of power electronics systems requires advanced thermal management technology. Introduction of micro-channel heat sink into power electronics cooling has significantly improved the cooling performance. In present work, two advanced micro-channel structures, i.e. double-layer (DL) and double-side (sandwich) with water as coolant, are optimized and compared by computational fluid dynamics (CFD) study. The micro-channels are integrated inside the Cu-layer of direct bond copper (DBC). The effects of inlet velocity, inlet temperature, heat flux are investigated during geometry optimization. The major scaling effects including temperature-dependent fluid properties and entrance effect are considered. Based on the optimal geometry, the sandwich structure with counter flow shows a reduction in thermal resistance by 59%, 52% and 53% compared with single-layer (SL), DL with unidirectional flow and DL with counter flow respectively. Water based Al2O3 (with concentration of 1% and 5%) nanofluid is further applied which shows remarkable improvement for wide channels. (C) 2014 Elsevier Ltd. All rights reserved.