In-situ investigation of the interplay between microstructure and anodic copper dissolution under near-ECM conditions—Part 2: The transpassive state
In-situ investigation of the interplay between microstructure and anodic copper dissolution under near-ECM conditions—Part 2: The transpassive state
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DOI：
10.1016/j.electacta.2012.03.066
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发表时间：
2011-09
影响因子：
6.6
通讯作者：
M. Schneider;S. Schroth;S. Richter;S. Höhn;N. Schubert;A. Michaelis
中科院分区：
文献类型：
--
作者：
M. Schneider;S. Schroth;S. Richter;S. Höhn;N. Schubert;A. Michaelis
在近 ECM 条件下在硝酸钠中阳极溶解纯铜期间，同时研究了单个晶粒的晶体取向对溶解行为的影响。可以区分两种不同的状态——主动状态和被动状态。溶解显示从一种状态到另一种状态的连续转变，具体取决于电流密度 jc ，而电流密度本身由电解质的速度决定。对于j<jc，活性状态由方向相关的阳极溶解来标记。在临界密度以上，晶粒的晶体取向不再是影响因素，因此发生均匀溶解。这称为跨被动状态，本文将对此进行详细分析。为此，进行了将电化学和光学显微镜与 EBSD 研究和电流效率测量相结合的原位实验。
During the anodic dissolution of pure copper in sodium nitrate under near-ECM conditions the influence of the crystallographic orientation of individual grains on the dissolution behaviour was simultaneously investigated. Two different states can be distinguished – the active and the transpassive state. The dissolution shows a continuous transition from one state to the other, depending on the current density jcwhich itself is determined by the velocity of the electrolyte. For j<jcthe active state is marked by an orientation dependant anodic dissolution. Above the critical density jcthe crystallographic orientation of the grains is no longer an influencing factor and therefore a homogenous dissolution takes place. This is called the transpassive state which will be analysed in this paper in detail. For this, in-situ-experiments combining electrochemistry and optical microscopy together with EBSD investigations and current efficiency measurements had been undertaken.