Wettability and interfacial reaction mechanism between Ag-Cu alloy and Si3N4 ceramics in air atmosphere
Wettability and interfacial reaction mechanism between Ag-Cu alloy and Si3N4 ceramics in air atmosphere
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空气气氛中Ag-Cu合金与Si3N4陶瓷的润湿性及界面反应机理
DOI：
10.1016/j.ceramint.2021.08.209
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发表时间：
2021
影响因子：
5.2
通讯作者：
Lu Xionggang
中科院分区：
文献类型：
--
作者：
Wang Ruidong;Zhang Chao;Li Dan;Xie Zixin;Zhang Yuwen;Lu Xionggang
研究了不同铜含量Ag-Cu合金钎料与si3n4陶瓷在970℃下的润湿行为和界面反应机理。随着铜含量的增加，Ag-Cu填料在si3n4陶瓷上的接触角减小。实验过程中观察到剧烈的类似沸腾的界面反应，质谱分析鉴定出气体产物为N2、NO和NO2。界面形成固体产物sio2和Cu-O，界面反应提高了Ag-Cu填料在si3n4陶瓷上的润湿性。由于浮力和气体的推动作用，界面产物浮向填料表面，其分布随着铜含量的增加而增大。在三线附近的界面处形成了两种不同的微观组织。低铜含量（Ag-3Cu / Ag-5Cu）和高铜含量（Ag-6.6Cu / Ag-16Cu）填料的三线界面上分别形成厚、薄sio2层。Ag-5Cu、Ag-6.6Cu和Ag-16Cu试样中均形成界面键合区，表明相应的Ag-Cu钎料与si3n4陶瓷有效钎焊。
The wetting behaviour and interfacial reaction mechanism between Ag–Cu alloy fillers (with varying copper contents) and Si3N4ceramics using reactive air brazing at 970 °C were systematically investigated. As the copper content increased, the contact angles of the Ag–Cu filler on the Si3N4ceramics decreased. A violent boiling-like interfacial reaction was observed during the experiment, and mass spectrometry analysis identified the gaseous products as N2, NO and NO2. The solid products SiO2and Cu–O formed at the interface, and the interfacial reactions improved the wettability of the Ag–Cu filler on the Si3N4ceramics. Owing to buoyancy and the pushing of the gases, the interfacial products floated to the surface of the filler and their distribution increased along with the increasing copper content. Two different microstructures were formed at the interface near the triple line. Thick and thin SiO2layers were respectively formed on the triple line interface of the fillers with low (Ag–3Cu/Ag–5Cu) and high (Ag–6.6Cu/Ag–16Cu) copper content. The interfacial bonding zones formed in Ag–5Cu, Ag–6.6Cu, and Ag–16Cu samples indicated that the corresponding Ag–Cu fillers were effectively brazed with the Si3N4ceramics.