Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders
Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders
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DOI：
10.1063/1.1925317
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发表时间：
2005-05-02
影响因子：
4
通讯作者：
Reichl, H
中科院分区：
文献类型：
--
作者：
Huang, ML;Loeher, T;Reichl, H
本研究的重点是在固/液反应伴随着界面金属间化合物的形成过程中，Cu含量在高Sn焊料中Cu的溶解动力学中的作用。在高锡焊料中添加少量的铜（0.7%，1.5%）显著降低了低温下铜的溶解速率。Sn-3.5Ag，如预期的那样，具有与纯Sri相似的溶解速率。根据Cu-Sn相图，用Cu在钎料熔体中的溶解极限解释了Cu在不同钎料熔体中溶解速率的差异。界面η（Cu 6Sn 5）相的形成和溶解动力学的Cu在熔融焊料的冶金方面之间的相关性导致理解的机制，控制溶解速率的Cu在熔融焊料。(c)2005年美国物理学会。
The focus of this study is on the role of Cu content in the dissolution kinetics of Cu in high-Sn solders during the solid/liquid reaction accompanied by interfacial intermetallic compound formation. Small additions of Cu (0.7%, 1.5%) in high-Sn solders dramatically decrease the dissolution rate of Cu at low temperatures. Sn-3.5Ag, as expected, has a dissolution rate similar to that of pure Sri. The difference in dissolution rate of Cu in various molten solders is explained in terms of the solubility limit of Cu in molten solders based on the Cu-Sn phase diagram. The correlation between the metallurgical aspects of interfacial eta(Cu6Sn5) phase formation and dissolution kinetics of Cu in molten solders leads to an understanding of the mechanism that controls the dissolution rate of Cu in molten solders. (c) 2005 American Institute of Physics.