The Influence of Microstructure on Thermal Conductivity of SiC Liquid-Phase-Sintered with BeO Addition
The Influence of Microstructure on Thermal Conductivity of SiC Liquid-Phase-Sintered with BeO Addition
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添加 BeO 液相烧结 SiC 微观结构对热导率的影响
DOI：
10.2472/jsms.54.559
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发表时间：
2005
期刊：
影响因子：
--
通讯作者：
K. Urabe
中科院分区：
文献类型：
--
作者：
H. Nakano;K. Watari;K. Ishizaki;K. Urabe
在室温下，掺BeO的碳化硅陶瓷的导热系数高达270W(MK)-1，高于其他非氧化物陶瓷。重点研究了添加少量BeO后所形成的微观结构。透射电子显微镜图像显示了新的微观结构数据，以了解该碳化硅陶瓷的热导率。在碳化硅烧结过程中加入BeO形成了液相，提高了碳化硅陶瓷的致密化程度。一种非常薄的晶间薄膜以非晶态的形式存在于几乎所有的颗粒表面。在液态烧结过程中，Fe、Ni、Al、V、Ti和O等杂质也从液态三晶结处析出。
The thermal conductivity of SiC ceramics sintered with BeO exhibited a higher value of 270W (mK)-1 at room temperature than that of the other non-oxide ceramics. We focused on the microstructure formed by addition of a small amount of BeO. TEM images revealed new microstructural data for understanding the thermal conductivity of this SiC ceramics. BeO addition in the SiC sintering formed a liquid phase, and densification of SiC ceramics was improved. A kind of very thin intergranular film existed as an amorphous state on the surfaces of almost all of the grains. During the liquid-phase sintering process, impurities of Fe, Ni, Al, V, Ti, and O were also precipitated at the triple-grain junction from the liquid phase.