Experimental Research on the Influence of the KDP Crystal Anisotropy on Scratch Characteristics
Experimental Research on the Influence of the KDP Crystal Anisotropy on Scratch Characteristics
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发表时间：
2012
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通讯作者：
Zhang Jianfu
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作者：
Zhang Jianfu
利用0°金刚石球形压头对KDP晶体的二次谐波（SHG）晶面进行了纳米划痕实验，在0 ~ 150 mN的梯度载荷下，沿420 μm划痕长度方向形成了沿着45°和90°方向的划痕，用扫描电镜观察了划痕形貌，确定了脆性向韧性转变的起始点和脆性与韧性的去除比例结果表明：0°、45 °和90°方向的脆韧转变点分别为209.0 μ m、158.5 μm和112.6 μ m; 0 °方向是最佳加工方向，因为在0°方向上被划伤的工件具有最晚的脆韧转变点，磨削演示试验结果表明，工件在0°加工时，平均切削力和表面粗糙度最小，从而验证了0°是KDP晶体SHG面的最佳加工取向。
Nano-scratch test has been conducted on the second harmonic generation(SHG) crystal face of KDP crystal using a diamond spherical indenter with 0°,45° and 90° scratch orientations along a scratch length of 420 μm under a ramp loading from 0 to 150 mN.The scratch morphology was observed by scanning electron microscopy.The starting transition point from brittle to ductile and the brittle and ductile removal proportion were obtained according to the scratch depth-scratch distance curve and the scratch morphology.Results showed that the transition point from brittle to ductile in 0°,45° and 90° orientation was 209.0 μm,158.5 μm and 112.6 μm.0° is the optimal processing orientation because the piece which was scratched in 0° had the latest transition point from brittle to ductile,the largest critical load and the least brittle removal during scratching.The conclusion of the grinding demonstration test was the averaged cutting force and the surface roughness were the least when the piece was machined in 0°.So it was validated that 0° is the optimal processing orientation KDP crystal SHG face.