Fabrication of reliable Cu-Cu joints by low temperature bonding isopropanol stabilized Cu nanoparticles in air
Fabrication of reliable Cu-Cu joints by low temperature bonding isopropanol stabilized Cu nanoparticles in air
复制标题
通过在空气中低温粘合异丙醇稳定的铜纳米颗粒制造可靠的铜-铜接头
DOI：
10.1016/j.matlet.2018.07.061
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发表时间：
2018-10-15
影响因子：
3
通讯作者：
Chen, Mingxiang
中科院分区：
文献类型：
--
作者：
Mou, Yun;Cheng, Hao;Chen, Mingxiang
我们提出了一种新的铜-铜键合方法，即在空气中低温键合异丙醇(IPA)稳定的铜纳米粒子(NPs)。合成的纳米铜颗粒直径约6.5 nm，具有良好的抗氧化性能，而异丙醇胺具有较低的沸点(160℃)和还原能力，为空气中低温键合提供了有利条件。因此，在250℃和275℃的空气中键合后，获得了可靠的高强度(~gt；25 Mpa)的铜-铜接头，键合的铜纳米颗粒层为未被氧化的铜晶体。此外，铜-铜接头的断口也表现出明显的韧性变形和烧结特征。(C)2018爱思唯尔B.V.保留所有权利。
We proposed a novel Cu-Cu bonding approach by low temperature bonding isopropanol (IPA) stabilized Cu nanoparticles (NPs) in air. The synthesized Cu NPs with the diameter size of about 6.5 nm have good anti-oxidative properties, and IPA has low boiling point (160 degrees C) and reductive ability, providing the favorable conditions for low temperature bonding in air. Consequently, reliable Cu-Cu joints with high strength (>25 MPa) are fabricated after bonding at 250 degrees C and 275 degrees C in air, and the bonded Cu NP layers are copper crystals without oxidation. Moreover, the fracture surfaces of Cu-Cu joints also display obvious ductile deformations and sintering characteristics. (C) 2018 Elsevier B.V. All rights reserved.