Effect of annealing on percolating porosity in ultrafine-grained copper produced by equal channel angular pressing
Effect of annealing on percolating porosity in ultrafine-grained copper produced by equal channel angular pressing
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DOI：
10.1016/j.actamat.2013.05.036
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发表时间：
2013-08
期刊：
影响因子：
9.4
通讯作者：
Jens Ribbe;G. Schmitz;D. Gunderov;Y. Estrin;Y. Amouyal;G. Wilde;S. Divinski
中科院分区：
文献类型：
--
作者：
Jens Ribbe;G. Schmitz;D. Gunderov;Y. Estrin;Y. Amouyal;G. Wilde;S. Divinski
在等通道转角挤压生产的超细晶铜中发现了渗流孔洞作为一种特定类型的变形诱导(Ribbe等人，Phys Rev Lett 2009；102：165501)。对于不同纯度的UFG铜，研究了这种缺陷类型在不同条件下的抗退火稳定性。在纯净的Ar气氛中，气孔率可以经受1073K数小时的热处理，尽管有明显的组织转变。在Ar中1313K的热处理消除了渗流孔洞，在含氢气氛中427K的相对较短的热处理也是如此。在中等温度下施加准静水压力，例如在423K下施加1 Gpa，也可以消除渗流孔洞。提出了孔隙度演化模型，解释了实验结果。
Percolating porosity as a specific type of deformation-induced was discovered in ultrafine-grained (UFG) Cu produced by equal channel angular pressing (Ribbe et al., Phys Rev Lett 2009;102:165501). The stability of this defect type against annealing under various conditions is investigated for UFG Cu of different purity levels. The porosity is found to withstand the annealing treatments up to 1073K for several hours in purified Ar atmosphere, despite significant microstructure transformation. Annealing at 1313K in Ar removes the percolating porosity, as do relatively short heat treatments at 427K in a hydrogen-containing atmosphere. Quasi-hydrostatic pressure applied at moderate temperatures, e.g. 1GPa at 423K, eliminates the percolating porosity, too. A model of porosity evolution, which accounts for the experimental findings, is suggested.