Greatly enhanced thermal conductivity of polyimide composites by polydopamine modification and the 2D-aligned structure
Greatly enhanced thermal conductivity of polyimide composites by polydopamine modification and the 2D-aligned structure
复制标题
通过聚多巴胺改性和二维排列结构大大增强聚酰亚胺复合材料的导热性
DOI：
10.1016/j.ceramint.2020.07.340
复制
发表时间：
2020-12-15
影响因子：
5.2
通讯作者：
Chen, Yanhui
中科院分区：
文献类型：
--
作者：
Ding, Dongliang;Shang, Zhihui;Chen, Yanhui
高导热聚酰亚胺（PI）复合材料在耐热电子封装领域有着巨大的应用潜力，但PI基体与填料之间的界面差限制了其应用。本文采用真空过滤-热压法制备了聚多巴胺（PDA）修饰的六方氮化硼（h-BN@PDA）/聚酰亚胺（PI）复合材料。在该复合材料中，PDA改性后的PI基体和h-BN微片之间的界面相互作用大大增强，并成功地构建了二维取向结构。本论文研究了PDA改性对PI复合材料导热性能、热稳定性和力学性能的影响。h-BN@PDA/PI复合材料的热导率随改性填料含量的增加而增加，并在面内和穿面方向上表现出明显的各向异性。20 vol% h-BN@PDA改性6 h（h-BN @PDA（6 h））/PI复合材料的面内热导率最高，为3.01 W m（-1）K-1，比纯PI样品提高了1405%，其T-10%达到525.2 ℃，拉伸强度和杨氏模量仍然很高，分别为38.80 MPa和8.33 GPa。本研究为高性能热管理材料的制备提供了一种可行的工艺。
Highly thermally conducive polyimide (PI) composites have great potential application in the heat-resistance electronic packaging field, but the poor interface between the PI matrix and fillers limits their application. Herein, we prepared the polydopamine (PDA) modified hexagonal boron nitride (h-BN@PDA)/polyimide (PI) composites by a simple "vacuum filtration - hot pressing" method. In this composite, the interfacial interaction between the PI matrix and h-BN micro-sheets was greatly enhanced after PDA modification, and a 2D-aligned structure was successfully constructed. In this work, the effect of PDA modification on the thermal conductivity, thermal stability and mechanical properties of PI composites was fully investigated. The thermal conductivity of the h-BN@PDA/PI composites rises as the modified filler increases, and reflects a distinct anisotropy on in-plane and through-plane direction. The highest in-plane thermal conductivity, 3.01 W m(-1) K-1, is obtained in the 20 vol% h-BN@PDA modified for 6 h (h-BN@PDA(6h))/PI composite, about 1405% higher than pure PI sample, while its T-10% reaches 525.2 degrees C, and the tensile strength and Young's modulus are still high, about 38.80 MPa and 8.33 GPa. Our study provides a feasible fabrication technology for the high-performance thermal management materials.