Effect of Surface Modification by Aqueous NaOH Solution on Bond Strength of Solid-State Bonded Interface of Al
Effect of Surface Modification by Aqueous NaOH Solution on Bond Strength of Solid-State Bonded Interface of Al
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NaOH水溶液表面改性对Al固相键合界面结合强度的影响
DOI：
10.2320/matertrans.m2013101
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发表时间：
2013
影响因子：
1.2
通讯作者：
I. Shohji
中科院分区：
文献类型：
--
作者：
S. Koyama;T. S. Keat;S. Amari;K. Matsubara;I. Shohji
铝合金具有高强度，并且由于其低熔点而易于回收。因此，铝被广泛用于制造汽车和电子设备。目前，粘合铝表面最常见的方法是钎焊。然而，钎焊需要位置精度，并导致焊剂残留物形成空隙;因此，为了避免这些问题，固态焊接方法被认为是一种可能的替代方法。然而，固态键合也存在一些需要克服的问题。这些问题之一是在铝表面上存在氧化物膜，需要在不施加高温和高负荷的情况下去除或破坏氧化物膜。因此，在这项研究中，一个结合表面处理用NaOH（aq）去除氧化膜，此外，这种处理的有效性，通过观察试样的结合界面和断裂面来确定。对于固态粘结，首先通过将试样在NaOH（aq）中煮沸20秒来对试样进行表面改性。然后在真空室中进行固态键合，键合温度为693 - 813 K，键合压力和键合时间分别固定为6 MPa和1.8ks。在固态结合之后，对试样进行拉伸试验以评估它们的强度。结果表明，无论表面改性与否，接头的抗拉强度均随连接温度的升高而提高。此外，表面改性导致高强度接头，在低粘结温度下变形较小。此外，在表面改性的情况下，实现强度高于铝的0.2%屈服应力的接头所需的接合温度和变形程度分别降低了100 K和25%。实验结果的基础上，它被确立为表面改性是有效的去除氧化膜和处理层上的铝表面。[doi：10.2320/matertrans.M2013101]
Aluminum alloys have high strength and are easily recyclable owing to their low melting point. Therefore, aluminum is widely used for manufacturing cars and electronic devices. Currently, the most common method for bonding aluminum surfaces is brazing. However, brazing requires positional accuracy and results in the formation of voids by the flux residue; therefore, to avoid these problems, solid-state bonding methods are considered as a possible alternative. However, solid-state bonding also suffers from some problems that need to be overcome. One of these problems is the presence of an oxide film on aluminum surfaces, necessitating the need to remove or destroy the oxide film without applying high temperature and high load. Hence, in this study, a bonding surface was treated with NaOH (aq) for removing the oxide film; moreover, the effectiveness of this treatment was determined by observing the bonding interfaces and fractured surfaces of specimens. For solidstate bonding, the specimens were first subjected to surface modification by boiling the specimens in NaOH (aq) for 20s. Solid-state bonding was then carried out at bonding temperatures ranging from 693 to 813K in a vacuum chamber with the bonding pressure and bonding time fixed at 6MPa and 1.8ks, respectively. After solid-state bonding, the specimens were subjected to the tensile test for evaluating their strength. The results revealed that the tensile strength of a joint increased with the bonding temperature with or without surface modification. Moreover, surface modification resulted in high-strength joints with less deformation at low bonding temperatures. In addition, the bonding temperature and degree of deformation needed to achieve joints with strength higher than the 0.2% proof stress of aluminum were 100K and 25% lesser, respectively, in the case of surface modification. On the basis of the experimental results, it was established that surface modification is effective for removing oxide films and processing layers on an aluminum surface. [doi:10.2320/matertrans.M2013101]
影响因子：
1.2
作者：
Hiraki, T;Takeuchi, M;Akiyama, T
通讯作者：
Akiyama, T