Measurement of residual stresses by X-ray diffraction techniques in MoN and Mo2N coatings deposited by arc PVD on high-speed steel substrate
Measurement of residual stresses by X-ray diffraction techniques in MoN and Mo2N coatings deposited by arc PVD on high-speed steel substrate
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DOI：
10.1016/j.surfcoat.2004.08.184
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发表时间：
2005-01
影响因子：
5.4
通讯作者：
C. Sarıoğlu;Uğur Demirler;M. K. Kazmanli;M. Ürgen
中科院分区：
文献类型：
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作者：
C. Sarıoğlu;Uğur Demirler;M. K. Kazmanli;M. Ürgen
多晶 MoN 和 Mo2N 薄膜具有良好的物理和机械性能，这使其成为微电子领域耐磨、耐腐蚀涂层和扩散阻挡层的候选材料。 MoN 和 Mo2N 薄膜中的残余应力由热应力和生长应力或沉积过程中产生的固有应力组成。使用摇摆和固定入射多平面 (FIM) 技术通过 XRD 测量通过电弧 PVD 技术在 HSS 基材上沉积的 MoN 和 Mo2N 涂层中的残余应力。通过这两种技术在 Mo2N（面心立方，f.c.c.）和 MoN（六方）薄膜中测量的残余应力分别约为 5 和 10 GPa（压缩）。这些结果表明，MoN 薄膜中的残余应力是 Mo2N 薄膜中残余应力的两倍。
Polycrystalline MoN and Mo2N films have promising physical and mechanical properties, which made them candidates for wear- and corrosion-resistant coatings and diffusion barriers in microelectronics. The residual stresses in MoN and Mo2N films consist of thermal and growth stresses or intrinsic stress generated during deposition. Residual stresses in the MoN and Mo2N coatings deposited by arc PVD techniques on HSS substrate were measured by XRD using the Rocking and the Fixed Incidence Multiplane (FIM) techniques. Residual stresses measured by both techniques in Mo2N (face center cubic, f.c.c.) and in MoN (hexagonal) films were about 5 and 10 GPa (compressive), respectively. These results indicated that residual stresses in the MoN film was two times greater than the residual stresses in the Mo2N film.