Electrical analysis of IC packaging with emphasis on different ball grid array packages
Electrical analysis of IC packaging with emphasis on different ball grid array packages
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IC 封装的电气分析，重点关注不同的球栅阵列封装
DOI：
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发表时间：
2001
期刊：
影响因子：
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通讯作者：
M. Caggiano
中科院分区：
文献类型：
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作者：
K. B. Unchwaniwala;M. Caggiano
随着工作频率的升高，与集成电路封装相关的寄生现象开始影响集成电路的性能。因此，有必要对包的各个组件进行正确建模，以更好地理解这些影响。本文提供了封装不同组件的等效电路模型，例如小外形封装和四方扁平封装中的封装引线、球栅阵列中使用的焊球、封装中的通孔和引线键合。此后，这些电气特性被用于对当前行业中使用的不同封装类型进行建模，重点是芯片连接或第一级互连的类型。获得的电气参数证实，随着工作频率增加到高 GHz 范围，与引线键合和包覆成型替代方案相比，大多数封装必须基于倒装芯片。
Parasitics associated with integrated circuit packaging are beginning to affect the performance of the integrated circuit with the rise in operating frequencies. Hence it has become necessary to properly model the various components of the package to provide better understanding of these effects. This paper provides equivalent circuit models for the different components of a package, such as the package leads in small outline packages and the quad flat-packs, the solder balls used in ball grid arrays, through via holes and wire bonds in packages. These electrical characteristics have thereafter been used to model different package types currently used in the industry with major emphasis being on the type of chip connect or the first level interconnection. The electrical parameters obtained confirm that most of the packages have to be flip chip based when compared to wire bonded and over-molded alternatives as the frequencies of operation increases to the high GHz range.