Interlayer design to control interfacial microstructure and improve mechanical properties of active brazed Invar/SiO2–BN joint
Interlayer design to control interfacial microstructure and improve mechanical properties of active brazed Invar/SiO2–BN joint
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DOI：
10.1016/j.msea.2013.03.055
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发表时间：
2013-07
期刊：
影响因子：
6.4
通讯作者：
Zhenwen Yang;L. X. Zhang;Ying Chen;J. Qi;P. He;Jiecai Feng
中科院分区：
文献类型：
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作者：
Zhenwen Yang;L. X. Zhang;Ying Chen;J. Qi;P. He;Jiecai Feng
设计了Ag-Cu/Cu/Ag-Cu-Ti复合中间层，成功地实现了因瓦合金与SiO2-BN陶瓷的钎焊。研究了铜箔厚度对钎焊接头组织和力学性能的影响。结果表明，与单一的Ag-Cu-Ti钎料相比，采用复合中间层可有效抑制脆性Fe 2 Ti和Ni 3 Ti化合物的形成，降低接头强度。液态填料中的活性Ti原子与SiO2-BN陶瓷反应形成TiN-TiB 2细晶层。获得了由层状Ag基和Cu基固溶体组成的界面组织，这有利于接头强度。当采用100μm厚的Cu中间层时，钎焊接头的剪切强度比采用单一Ag-Cu-Ti箔钎焊接头的剪切强度提高了207%。钎焊过程中对反应顺序的控制和Cu阻挡层的加入是抑制脆性化合物形成的主要原因。
Ag–Cu/Cu/Ag–Cu–Ti composite interlayer was successfully designed to braze Invar alloy and SiO2–BN ceramic. The effect of Cu-foil thickness on the microstructure and mechanical properties of the brazed joints was investigated. The results showed that, compared with single Ag–Cu–Ti brazing foil, the formation of brittle Fe2Ti and Ni3Ti compounds detrimental to the joint strength was greatly inhibited by using composite interlayer. The active Ti atoms in the liquid filler reacted with SiO2–BN ceramic to form a TiN–TiB2fine-grain layer. The desired interfacial microstructure composed of layered Ag- and Cu-based solid solutions was obtained, which was beneficial for the joint strength. The shear strength of brazed joints was 207% higher than the joints brazed with single Ag–Cu–Ti foil when a 100μm thick Cu interlayer was used. The inhibition of brittle compounds formation was attributed to the control of reaction sequences during brazing and to the addition of Cu barrier layer.