Formation of a self-interconnected joint using a low-melting-point alloy adhesive
Formation of a self-interconnected joint using a low-melting-point alloy adhesive
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使用低熔点合金粘合剂形成自互连接头
DOI：
10.2320/matertrans.45.799
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发表时间：
2004
影响因子：
1.2
通讯作者：
K. Fujimoto
中科院分区：
文献类型：
--
作者：
K. Yasuda;Jongmin Kim;M. Yasuda;K. Fujimoto
自互连过程是连接新型材料和组装微电子器件的有前途的方法之一。使用导电粘合剂和低熔点焊料（例如 Sn-In 共晶合金）制造微接头的基本实验被证明是传统焊接或电子组装中常用粘合剂连接的替代方法。通过光学和X射线透射显微镜检查了接头形态、导电互连的形成以及自互连特性。发现在接缝形成过程中会发生熔融填料的行为，例如聚集、聚结和润湿。特别是在玻璃环氧树脂基板的铜线图案上，熔融合金的选择性粘附润湿，通过树脂的氧还原能力和毛细管现象增强，是接头自互连的主要驱动力。需要正确设置填料的对准、接缝高度和体积分数才能成功粘合。
The self-interconnection process is one of the promising methodologies for joining novel materials and assembling micro-electronic devices. Basic experiments fabricating micro joints using conductive adhesives with low melting point solders, such as Sn-In eutectic alloy, were demonstrated as an alternative method to conventional soldering or using the usual adhesive joining used in electronic assembly. The joint morphology, the formation of electrical conduction interconnections, and the self-interconnection characteristics were examined by optical and X-ray transmission microscopy. The behaviors of melting fillers such as aggregation, coalescence, and wetting were found to occur during joint formation. Especially on the copper line patterns of a glass-epoxy substrate, selective adhesional wetting of the melting alloy, enhanced by the oxygen-reduction capability of resin and capillary phenomena, was the main driving forces of the self-interconnection of joints. The alignment, joint height, and volume fraction of the filler need to be set correctly for a successful adhesion to be achieved.