Evaluation of endothelial cell adhesion onto different protein/gold electrodes by EIS

Evaluation of endothelial cell adhesion onto different protein/gold electrodes by EIS
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DOI:
10.1002/mabi.200600263
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发表时间:
2007-05-10
影响因子:
4.6
通讯作者:
Ponsonnet, Laurence
Ponsonnet, Laurence
中科院分区:
工程技术3区
文献类型:
--
作者:
Bouafsoun, Amira;Helali, Saloua;Ponsonnet, Laurence

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为了研究细胞在生物材料上的附着,将纤维连接蛋白、IV型胶原、肝素、免疫球蛋白G和白蛋白等几种蛋白质分别沉积在聚苯乙烯上,并分别吸附在玻璃或金的自组装单分子膜(硅烷或硫醇)上。用电化学阻抗谱(EIS)对多层膜组装的不同步骤进行了表征。将这些数据与粘附率、存活率和细胞骨架标记的数据进行比较,以更好地了解细胞对每种蛋白质的黏附过程。所有的蛋白质都是内皮细胞黏附的生物分子,但具有不同的功能。对于所有带负电荷的蛋白质,粘附率与内皮细胞/蛋白质界面的阻力之间建立了线性关系。
To study cell attachment to biomaterials, several proteins such as fibronectin, Collagen IV, heparin, immunoglobulin G, and albumin have been deposited onto polystyrene adsorbed on a self-assembled monolayer (silane or thiol) on glass or gold, respectively. The different steps of this multilayer assembly have been characterized by electrochemical impedance spectroscopy (EIS). These data are compared to those of adhesion rate, viability percentage, and cytoskeleton labeling for a better understanding of the cell adhesion process to each protein. All the proteins are endothelial cell adhering biomolecules but not with the same features. A linear relationship has been established between adhesion rate and resistance of the endothelial cell/protein interface for all negatively charged proteins.