A nano-orthogonal cutting model based on a modified molecular dynamics technique
A nano-orthogonal cutting model based on a modified molecular dynamics technique
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DOI：
10.1088/0957-4484/15/5/019
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发表时间：
2004-02
期刊：
影响因子：
3.5
通讯作者：
Zone-Ching Lin;Jen-Ching Huang
中科院分区：
文献类型：
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作者：
Zone-Ching Lin;Jen-Ching Huang
提出了一种基于结合有限元法（FEM）和分子动力学（MD）技术的形状函数的概念，以评估芯片的形成和应变和应力分布在单晶铜的纳米级机制的基础上。将原子视为节点，将点阵视为单元，求解出纳米切削过程中原子在任意瞬态情况下的位移分量。利用分子动力学程序计算的原子位移，结合有限元形函数的概念，计算了原子尺度切削机构中材料变形的等效应变。等效应力是从对应的流动应力-应变曲线的等效应变导出的，而流动应力-应变曲线是从纳米铜薄膜拉伸试验模拟的应力-应变曲线的回归获得的。此外，在金刚石空间内的芯片原子被移动沿着工具表面使用的数学方法。此外，本研究在奈米级切削模型中引入一个新的概念：“结合莫尔斯势函数与刚性刀具空间限制准则作为切屑分离准则”。
A proposed method based on combining the concepts of shape functions of the finite element method (FEM) and a molecular dynamics (MD) technique was developed to evaluate the chip formation and strain and stress distribution in the cutting of single-crystal copper by a nano-scale mechanism. The displacement components for the atom in any temporary situation during the nano-scale cutting could be found. In this paper, the atom is regarded as a node and the lattice is regarded as an element. Using the atom displacements calculated by the MD program and combining the concepts of shape functions of FEM we calculate the equivalent strain for material deformation in the atomic-scale cutting mechanism. The equivalent stress was derived from the equivalent strain from the corresponding flow stress–strain curve, whereas the flow stress–strain curve was obtained from the regression of the stress–strain curve of a nano-copper thin film tension test simulation. In addition, the chip atoms within the diamond space were moved along the tool surface using a mathematical method. Also, this study introduced a new concept: 'a combined Morse potential function and rigid tool space restrictions criterion as the chip separation criterion' for the nano-scale cutting model.