Fabrication of a Wideband Antenna on a Low-Resistivity Silicon Substrate Using a Novel Micromachining Technique
Fabrication of a Wideband Antenna on a Low-Resistivity Silicon Substrate Using a Novel Micromachining Technique
复制标题
使用新型微加工技术在低电阻率硅基板上制造宽带天线
DOI：
10.1109/lawp.2007.907053
复制
发表时间：
2007
影响因子：
4.2
通讯作者：
R. Murch
中科院分区：
文献类型：
--
作者：
Jie;R. Murch
介绍了一种利用新型微机械加工技术在低电阻率硅衬底上制作宽带天线的方法。宽带天线是基于差分馈电偶极子的设计，是在一个修改后的硅基板上制造，这消除了与天线效率和强度相关的问题。从我们制作的天线的结果表明，它的谐振频率约为5.8 GHz，并具有超过43%的带宽，使其潜在的IEEE 802.11a和超宽带（UWB）的应用。天线的尺寸为12 mm × 2.8 mm × 0.4 mm。此外，所制造的天线表现出超过20%的效率，并具有-1.35 dBi的增益，这对于在低电阻率硅衬底上制造的紧凑型天线是好的。
Fabrication of a wideband antenna on a low-resistivity silicon substrate using a novel micromachining technique is described. The wideband antenna is based on a differential-fed dipole based design that is fabricated on a modified silicon substrate and this eliminates problems associated with antenna efficiency and strength. Results from our fabricated antenna reveal that it resonates at around 5.8 GHz and has a bandwidth of more than 43% making it potentially suitable for IEEE 802.11a and ultrawideband (UWB) applications. The size of the antenna is 12 mm times 2.8 mm times 0.4 mm. Furthermore, the fabricated antenna exhibits an efficiency of more than 20% and has a gain of - 1.35 dBi, which is good for a compact antenna fabricated on a low resistivity silicon substrate.