Humidity Effects on Sn Whisker Formation
Humidity Effects on Sn Whisker Formation
复制标题
湿度对锡晶须形成的影响
DOI：
10.1109/tepm.2006.887358
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发表时间：
2006
影响因子：
--
通讯作者：
Elton Yu
中科院分区：
文献类型：
--
作者：
P. Oberndorff;M. Dittes;P. Crema;P. Su;Elton Yu
由于立法问题，半导体元件上的含铅金属化迅速转化为不含铅的替代品。电镀锡是最受欢迎的替代方法之一。这些镀层的主要问题是锡晶须的形成。在早期的出版物中，发现了两种导致晶须生长的机制。然而，这些机制并不能解释高湿度条件下的晶须生长。因此，飞思卡尔、英飞凌、飞利浦和意法半导体（E4）联合起来，开始了一项实验设计（DoE），以解决这一机制。结果表明，在高湿条件下，无论基材是什么，晶须都是由于镀锡的氧化和腐蚀而生长的。还表明，板装配通过这种机制减轻了晶须的生长，但并不能完全阻止它
Due to legislative issues, Pb-containing metallizations on semiconductor components are rapidly converted to Pb-free alternatives. One of the most popular alternatives is Sn electroplating. The major problem of these platings is the formation of Sn whiskers. In earlier publications, two mechanisms were uncovered that are responsible for whisker growth. However, these mechanisms do not explain whisker growth in high humidity. Therefore, Freescale, Infineon, Philips, and STMicrolectronics (E4) joined forces and started a design of experiment (DoE) in order to resolve this mechanism. It is shown that in high humidities, whiskers grow due to oxidation and corrosion of the Sn plating, irrespective of the base material. It is also shown that board assembly mitigates the whisker growth by this mechanism but does not completely prevent it