Recovery stress generation in shape memory Ti50Ni45Cu5 thin wires
Recovery stress generation in shape memory Ti50Ni45Cu5 thin wires
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DOI：
10.1016/s0921-5093(00)00816-9
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发表时间：
2000-07
期刊：
影响因子：
6.4
通讯作者：
P. Šittner;D. Vokoun;G. Dayananda;R. Stalmans
中科院分区：
文献类型：
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作者：
P. Šittner;D. Vokoun;G. Dayananda;R. Stalmans
约束Ti 50 Ni 45 Cu 5中回复应力的演变（at.%）在结合电阻测量进行的热机械实验中研究形状记忆线。通过将实验结果与模拟响应进行比较，分析了约束热循环中丝的滞后应力-温度响应，所述模拟响应使用为预测单轴热机械SMA行为而开发的唯象算法。预测了单个SMA材料参数、约束参数、试验边界条件和热机械历史对SMA丝回复应力演化的影响。
The recovery stresses evolving in constrained Ti50Ni45Cu5(at.%) shape memory wires were investigated in thermomechanical experiments performed in combination with electric resistance measurements. The hysteretic stress–temperature responses of the wires in constrained thermal cycles were analyzed by comparing the experimental results with simulated responses using a phenomenological algorithm developed for prediction of uniaxial thermomechanical SMA behaviors. The effects of individual SMA material parameters, constraint parameters, test boundary conditions and thermomechanical history on the evolution of recovery stresses in SMA wires are predicted.