EFFECT OF TEMPERATURE ON ADHESIVE FRACTURE BEHAVIOR OF AN ELASTOMER EPOXY RESIN
EFFECT OF TEMPERATURE ON ADHESIVE FRACTURE BEHAVIOR OF AN ELASTOMER EPOXY RESIN
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DOI：
10.1080/00218467608075063
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发表时间：
1976-01-01
影响因子：
2.2
通讯作者：
COTTINGTON, RL
中科院分区：
文献类型：
--
作者：
BASCOM, WD;COTTINGTON, RL
用15%羧基封端的丁二烯丙烯腈改性的二缩水甘油醚双酚A环氧树脂的本体和粘合剂断裂行为被确定为温度的函数。体积断裂韧性在树脂附近以类似于未改性环氧树脂的方式急剧增加。粘合剂的断裂能表现出最大值相对于债券的厚度，这个最大值扩大，并转移到更大的债券厚度随着温度的升高。根据裂尖变形区的大小和应力状态对这些结果进行了讨论。
The bulk and adhesive fracture behavior of a diglycidyl ether bisphenol-A epoxy modified with 15% carboxy-terminated butadiene acrylonitrile was determined as a function of temperature. The bulk fracture toughness increased sharply near the resinTgin a manner similar to unmodified epoxy resins. The adhesive fracture energy exhibited a maximum with respect to bond thickness and this maximum broadened and shifted to larger bond thicknesses with increasing temperature. These results are discussed in terms of the size and stress condition of the crack tip deformation zone.