Tuning the architectures of lead deposits on metal substrates by electrodeposition
Tuning the architectures of lead deposits on metal substrates by electrodeposition
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DOI：
10.1016/j.electacta.2008.08.005
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发表时间：
2008-12
影响因子：
6.6
通讯作者：
Chenzhong Yao;Meng Liu;Peng Zhang;Xiaoqing He;Gao‐Ren Li;Wenxia Zhao;Peng Liu;Y. Tong
中科院分区：
文献类型：
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作者：
Chenzhong Yao;Meng Liu;Peng Zhang;Xiaoqing He;Gao‐Ren Li;Wenxia Zhao;Peng Liu;Y. Tong
通过在水溶液中进行电化学沉积，可以制备沉积在不同金属基底上的不同形貌的铅（Pb）。通过扫描电子显微镜（SEM）测定沉积态铅的形貌。研究发现，产物的各种形貌取决于电沉积条件，包括沉积电流密度、添加剂浓度、基材和沉积时间。 X射线衍射（XRD）和透射电子显微镜（TEM）结果表明，所有这些具有不同形貌的铅沉积物都可以归属于空间群Fm-3m（225）。
Different morphologies of lead (Pb) deposited on different metal substrates have been prepared via electrochemical deposition in aqueous solution. The morphologies of as-deposited lead were determined by scanning electron microscope (SEM). It is found that the various morphologies of the products are dependent on the electrodeposition conditions, including the deposition current densities, concentration of additives, substrates and deposition time. X-ray diffraction (XRD) and transmission electron microscope (TEM) results reveal that all these lead deposits with different morphologies can be assigned to the space group Fm-3m (225).