Intermetallic Compound Formation andGrowth at the Lead-Free Solder/CuInterface during Laser Reflow Solderingand during Isothermal Aging
Intermetallic Compound Formation andGrowth at the Lead-Free Solder/CuInterface during Laser Reflow Solderingand during Isothermal Aging
复制标题
激光回流焊接和等温老化过程中无铅焊料/铜界面金属间化合物的形成和生长
DOI：
--
复制
发表时间：
2012
期刊：
影响因子：
--
通讯作者：
N. Iwata and T. Takemoto
中科院分区：
文献类型：
--
作者：
H. Nishikawa;N. Iwata and T. Takemoto
