Enhanced Thermal Conductivity of All-Organic Aramid Nanofiber Films via Interfacial Coupling Reaction
Enhanced Thermal Conductivity of All-Organic Aramid Nanofiber Films via Interfacial Coupling Reaction
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DOI：
10.1021/acsapm.2c01007
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发表时间：
2022-08
影响因子：
5
通讯作者：
Boya Liu;Yang Liu;Xiangyang Liu
中科院分区：
文献类型：
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作者：
Boya Liu;Yang Liu;Xiangyang Liu
制备具有高平面导热系数和穿透导热系数的全有机导热膜仍然是一个巨大的挑战。在这里，我们设计了一种全有机芳纶纳米纤维薄膜，其面内导热系数和透面导热系数分别高达15.7W/mK和0.26W/mK。证明了直接氟化可以诱导相邻芳纶大分子中的苯环发生偶联反应，在芳纶纳米纤维之间形成大量的共价交联键。由于交联性的存在，纳米纤维之间的界面热阻得到了一定程度的抑制，从而使膜的面内导热系数和透面导热系数分别比未改性膜提高了78.8%和271.7%。此外，该薄膜还具有较高的机械强度和电绝缘性，使其在柔性电子领域具有广阔的应用前景。
It is still a great challenge to prepare intrinsically all-organic thermal conductive membrane with high in-plane and through-plane thermal conductivity. Herein, we designed an all-organic aramid nanofiber thin film with in-plane and through-plane thermal conductivity as high as 15.7 and 0.26 W/mK, respectively, through one step fluorination utilizing F2/N2. We proved that direct fluorination could induce the coupling reaction of benzene rings in neighboring aramid macromolecules to form numerous covalent cross-linking bonds among aramid nanofibers. Benefiting from the cross-linking behavior, interfacial thermal resistance between the nanofibers was suppressed to some extent, thereby leading to enhancement of in-plane and through-plane thermal conductivity by 78.8% and 271.7%, respectively, compared with the unmodified membranes. In addition, the thin films also possess high mechanical strength and electrical insulation, which promote its application potential in flexible electronic fields.