Optical bonding of tellurite glass film on silicate glass
Optical bonding of tellurite glass film on silicate glass
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亚碲酸盐玻璃薄膜与硅酸盐玻璃的光学粘合
DOI：
10.1111/ijag.13094
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发表时间：
2018
影响因子：
2.1
通讯作者：
Tetsuji Yano
中科院分区：
文献类型：
--
作者：
Ray-Jay Jeng; Tetsuo Kishi; Nobuhiro Matsushita; Tetsuji Yano
通过直接键合（DB）方法将碲酸盐玻璃薄膜成功地键合在硅酸盐玻璃基板上。通过玻璃吹制技术制造玻璃膜（厚度1 - 3 μm），并在室温和62%或15%的相对湿度（RH）下进行DB工艺。通过Obreimoff-Metsik方法测量，在15%和62%RH下粘合的玻璃膜的表面粘合强度分别为250和96 mJ/m2。通过傅里叶变换红外光谱分析了膜与硅酸盐玻璃之间界面上的羟基（-OH）官能团。在62% RH时，碲酸盐薄膜与硅酸盐玻璃之间的键合力主要为氢键，在15% RH时，碲酸盐玻璃上的Te与硅酸盐玻璃上的O之间的键合力主要为氢键。由Si-OH贡献的这些力对于62%的键形成是重要的。通过热重分析确定的硅酸盐玻璃上的大量水和OH基团表明在62%RH下的较弱的键合过程。这项工作将有助于为集成光学电路提供可靠、高完整性的组件，这对于高吞吐量数据传输越来越有必要。
Tellurite glass thin film was successfully bonded on a silicate glass substrate by the direct‐bonding (DB) method. Glass film (thickness 1‐3 μm) was fabricated by the glassblowing technique and the DB process was performed at room temperature at relative humidity (RH) of 62% or 15%. The surface adhesive strengths of the glass films bonded at 15% and 62% RH were measured as 250 and 96 mJ/m2, respectively, by the Obreimoff‐Metsik method. The hydroxyl (–OH) functional groups on the interface between the film and silicate glass were analyzed by Fourier‐transform infrared spectroscopy. The major bonding forces between the tellurite thin film and silicate glass were hydrogen bonds at 62% RH and bonds between Te on the tellurite glass and O on the silicate glass were concerned at 15% RH. These forces, contributed by Si–OH, were important for bond formation at 62%. The large amounts of water and OH groups on the silicate glass, determined by thermogravimetric analysis, indicated a weaker bonding process at 62% RH. This work will contribute toward reliable, high‐integrity components for integrated optical circuits, which are increasingly needed for high‐throughput data transfer.