Powder Particle Manipulation and Assemblage Using Microprobe
Powder Particle Manipulation and Assemblage Using Microprobe
复制标题
使用微探针进行粉末颗粒操纵和组装
DOI：
10.1177/1045389x9600700305
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发表时间：
1996
影响因子：
2.7
通讯作者：
N. Shinya
中科院分区：
文献类型：
--
作者：
M. Egashira;T. Konno;N. Shinya
粉末颗粒操纵和焊接技术，使用微探针已经开发用于微组装。这些技术被应用于通过组装粉末颗粒来制造微结构。对于微探针，制备具有直径为2 μ m的尖端的针。将直径约60-100 μ m的Au和Ni合金粉末颗粒用于操作和焊接实验。实验表明，通过控制钨微探针与衬底之间的电压，可以很容易地拾取Au粉末颗粒，并将其移动到预定的点，然后沉积在该点上。此外，粉末颗粒可以通过探针的尖端和基底之间的辉光放电焊接到基底或基底上的其他粉末颗粒中。利用粉末颗粒控制和焊接技术，制备了由Au和Ni合金粉末颗粒组成的微结构。结果表明，微探针技术在微机械和微器件的制造中是非常有用的。此外，该技术被认为对智能材料的创造有用。
Powder particle manipulation and welding techniques using a microprobe have been developed for use of microassembling. These techniques were applied to fabrication of microstructures by assembling powder particles. For the microprobe, a needle with a tip of 2 Am in diameter was prepared. Au and Ni alloy powder particles of about 60-100 Jim diameter were used for the manipulation and welding experiments. The experiments showed that Au powder particles can be easily picked up, moved to a predetermined point and deposited at the point by controlling the voltage between the W microprobe and the substrate. Furthermore, the powder particle can be welded into the substrate or other powder particles on the substrate by glow discharge between the tip of the probe and the substrate. By utilization of the powder particle manipulation and welding, microstructures composed of Au and Ni alloy powder particles were fabricated. It was demonstrated that the microprobe technique is very useful for the fabrication of micromachines and microdevices. Also, the technique is thought to be useful for the creation of intelligent materials.