A Review of Hybrid Supply Modulators in CMOS Technologies for Envelope Tracking PAs
A Review of Hybrid Supply Modulators in CMOS Technologies for Envelope Tracking PAs
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DOI：
10.1109/tpel.2022.3233441
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发表时间：
2023-05
影响因子：
6.7
通讯作者：
Sumit Bhardwaj;S. Moallemi;J. Kitchen
中科院分区：
文献类型：
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作者：
Sumit Bhardwaj;S. Moallemi;J. Kitchen
本文回顾了用于包络跟踪功率放大器 (ET-PA) 的基于 CMOS 的电源调制器 (SM) 的趋势、架构和最新发展。本综述详细介绍了 CMOS 中最常用的混合电源调制器 (HSM) 架构，并讨论了其性能要求和设计挑战。阐述了 HSM 设计中效率、速度、线性度和输出功率的重要性，并提出了侧重于最大化这些性能参数的不同方法。最后，讨论了包络跟踪系统的设计挑战，并概述了用于实现 SM 和 ET-PA 的设备技术。
This article reviews trends, architectures, and recent developments in CMOS-based supply modulators (SM) used for envelope-tracking power amplifiers (ET-PAs). This review details the most commonly used hybrid supply modulator (HSM) architecture in CMOS and discusses its performance requirements and design challenges. The importance of efficiency, speed, linearity, and output power in HSM design is delineated and different methods that focus on maximizing these performance parameters are presented. Finally, the design challenges of envelope tracking systems are discussed, and an overview of device technologies for implementing SM and ET-PAs is given.