Resonant polymer ablation using a compact 3.44 μm fiber laser
Resonant polymer ablation using a compact 3.44 μm fiber laser
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DOI：
10.1016/j.jmatprotec.2017.10.051
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发表时间：
2018-02
影响因子：
6.3
通讯作者：
Clément Frayssinous;V. Fortin;J. Bérubé;A. Fraser;R. Vallée
中科院分区：
文献类型：
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作者：
Clément Frayssinous;V. Fortin;J. Bérubé;A. Fraser;R. Vallée
在这项实验研究中，我们研究了使用发射波长为 3.44 μm 的新型光纤激光源进行聚合物烧蚀，该波长与广泛使用的聚合物材料的 C 单键 H 键基本拉伸频率共振。研究发现，激光的波长和材料中的加热方式在聚合物的烧蚀过程中发挥着关键作用。我们比较了使用 3.44 μm 光纤激光器和 10.6 μm CO2 激光器对三种常见聚合物（聚甲基丙烯酸甲酯、聚丙烯和聚乙烯）进行的两个系列实验的结果。通过实验评估了烧蚀阈值、其效率以及激光诱导凹槽的形态。使用中红外光纤激光器进行聚合物加工可应用于多种成分，并且具有强大的应用潜力。
In this experimental study, we investigate polymer ablation with a novel fiber laser source emitting at 3.44 μm, a wavelength resonant with the Csingle bondH bond fundamental stretching frequency of widespread polymer materials. The wavelength of the laser and the heating regime in the material are found to play key roles in the ablation process of polymers. We compare the results from two series of experiments performed, with both the 3.44 μm fiber laser and a CO2laser at 10.6 μm, on three common polymers: poly(methyl methacrylate), polypropylene and polyethylene. The ablation thresholds, its efficiency as well as the morphology of laser-induced grooves are evaluated experimentally. Polymer processing with mid-IR fiber lasers could be applied to a wide variety of compositions and has a strong potential for applications.