Cycling copper flip chip interconnects
Cycling copper flip chip interconnects
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DOI：
10.1016/j.microrel.2004.03.010
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发表时间：
2004-07-01
影响因子：
1.6
通讯作者：
Jittinorasett, S
中科院分区：
文献类型：
--
作者：
Roesch, WJ;Jittinorasett, S
Use of flip chip assembly on compound semiconductor circuits is relatively new. Although solder bumping has been around for a while, use of copper bumps is also new. This discussion is intended to provide some initial data on the melding of copper flip chip bumps and compound semiconductor technologies, with respect to thermal excursion testing-cycling. For comparison, it is known that attempts to accelerate degradation caused by thermal excursions on solder bumps can result in irregular failure mechanisms. This work shows that on-chip power cycling can be used to cause identical failure mechanisms to those caused by normal temperature cycling. (C) 2004 Elsevier Ltd. All rights reserved.
