Thermal Properties of Graphene-Copper-Graphene Heterogeneous Films
Thermal Properties of Graphene-Copper-Graphene Heterogeneous Films
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DOI：
10.1021/nl404719n
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发表时间：
2014-03-01
期刊：
影响因子：
10.8
通讯作者：
Balandin, Alexander A.
中科院分区：
文献类型：
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作者：
Goli, Pradyumna;Ning, Hao;Balandin, Alexander A.
我们通过实验证明，石墨烯-Cu-石墨烯异质膜与参考Cu和退火Cu膜相比显示出强烈增强的热导率。在9 μ m厚的Cu膜的两侧上化学气相沉积石墨烯的单原子平面使其热导率在室温附近增加高达24%。有趣的是，所观察到的石墨烯/Cu石墨烯异质膜的热性能的改善主要是由于石墨烯沉积期间Cu形态的变化，而不是由于石墨烯作为额外的导热通道的作用。石墨烯覆盖的Cu膜的热性质的增强对于先进电子芯片的热管理和石墨烯在混合石墨烯-Cu互连层级中的建议应用是重要的。
We demonstrated experimentally that graphene-Cu-graphene heterogeneous films reveal strongly enhanced thermal conductivity as compared to the reference Cu and annealed Cu films. Chemical vapor deposition of a single atomic plane of graphene on both sides of 9 mu m thick Cu films increases their thermal conductivity by up to 24% near room temperature. Interestingly, the observed improvement of thermal properties of graphene Cu graphene heterofilms results primarily from the changes in Cu morphology during graphene deposition rather than from graphene's action as an additional heat conducting channel. Enhancement of thermal properties of graphene-capped Cu films is important for thermal management of advanced electronic chips and proposed applications of graphene in the hybrid graphene-Cu interconnect hierarchies.