Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process
Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process
复制标题
DOI：
10.1016/j.msea.2006.10.139
复制
发表时间：
2007-04
期刊：
影响因子：
6.4
通讯作者：
Jong‐Woong Kim;Seung-Boo Jung
中科院分区：
文献类型：
--
作者：
Jong‐Woong Kim;Seung-Boo Jung
研究了各向异性导电膜（ACF）倒装芯片封装的热机械可靠性，分析了键合力对封装失效模式的影响。采用传统的回流焊工艺对封装的可靠性进行了评估。在这项研究中检测到两种失效模式。第一个原因是导电颗粒和Ni/Au电镀Cu焊盘之间形成导电间隙，而第二个原因是粘合剂基质从柔性基板上的电镀Cu焊盘剥离。失效模式的确定主要受粘结力变化的影响。在具有较低粘结力的ACF接头的情况下，导电间隙是回流焊接头的主要失效模式，而在具有较高粘结力的接头的情况下，经常观察到粘合剂基质的分层。在正文中讨论了失效模式的差异。
Thermo-mechanical reliability of flip chip packages employing anisotropic conductive film (ACF) was investigated in terms of the effect of bonding forces on the failure mode of the packages. Conventional reflow process was conducted to evaluate the reliability of the package. Two kinds of failure modes were detected in this study. The first one is formation of a conduction gap between conductive particle and Ni/Au plated Cu pad, while the second one is delamination of the adhesive matrix from the plated Cu pad on flexible substrate. The determination of the failure mode was mainly affected by the variation of the bonding force. In case of the ACF joints with lower bonding forces, a conduction gap was the main failure mode of the reflowed joints, while the delamination of the adhesive matrix was frequently observed in case of the joints with higher bonding forces. The difference in failure mode was discussed in the main text.