Bumpless Build-Up Layer Packaging

Bumpless Build-Up Layer Packaging
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无凸块堆积层封装

DOI：
10.1115/imece2001/epp-24703
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发表时间：
2001
期刊：
Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products
影响因子：
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通讯作者：
G. Vandentop
G. Vandentop
中科院分区：
--
文献类型：
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作者：
S. Towle;H. Braunisch;Chuan Hu;R. Emery;G. Vandentop

文献摘要

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无缓冲积层(BBUL)是为满足未来封装技术要求而开发的一种新型封装。BBUL封装提供了小电环电感和降低低介电常数(Low-k)芯片材料的热机械应力的优势。此外，它还允许高铅数、多个电子和光学组件[如逻辑、存储器、射频、微电子机械系统(MEMS)等]的随时集成，以及固有的可扩展性。在本文中，我们研究和讨论了BBUL的一些工艺、布线、电、热和机械属性。
Bumpless Build-Up Layer (BBUL) is a novel package developed to meet future packaging technology requirements. The BBUL package provides the advantages of small electrical loop inductance and reduced thermomechanical stresses on low dielectric constant (low-k) die materials. Furthermore, it allows for high lead count, ready integration of multiple electronic and optical components [such as logic, memory, radio frequency, microelectromechanical systems (MEMS), among others], and inherent scalability. In the present paper we investigate and discuss some of the process, routing, electrical, thermal, and mechanical attributes of BBUL.