Interconnect design strategy: structures, repeaters and materials with strategic system performance analysis (S/sup 2/PAL) model
Interconnect design strategy: structures, repeaters and materials with strategic system performance analysis (S/sup 2/PAL) model
复制标题
互连设计策略：具有战略系统性能分析 (S/sup 2/PAL) 模型的结构、中继器和材料
DOI：
10.1109/16.902722
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发表时间：
2001
影响因子：
3.1
通讯作者：
Y. Hayashi
中科院分区：
文献类型：
--
作者：
S. Takahashi;M. Edahiro;Y. Hayashi
在本文中，我们提出了一种新的方法来设计互连策略，例如应该采用什么互连结构，如何插入中继器，以及何时应该采用新的金属或介质材料。在该方法中，新发展了战略性系统性能分析模型，作为根据晶体管和互连的电参数以及电路结构来预测LSI工作频率和芯片尺寸的计算模型。该模型的分析表明，在特定长度D/B c-cross/处，互连延迟克服了电路块周期时间。这里暂时将短于D/Sub c-cross/的互连称为局部互连，而将长于D/Sub c-cross/的互连称为全局互连。对局部层和全局层的横截面结构分别进行了优化。我们还计算了全局互连间距和由全局互连间距和插入的中继器放大的芯片尺寸，从而评估了引入新材料用于互连和介质的有效性。
In this paper, we propose a novel methodology for scheming an interconnect strategy, such as what interconnect structure should be taken, how repeaters should be inserted, and when new metal or dielectric materials should be adopted. In the methodology, the strategic system performance analysis model is newly developed as a calculation model that predicts LSI operation frequency and chip size with electrical parameters of transistors and interconnects as well as circuit configuration. The analysis with the model indicates that interconnect delay overcomes circuit block cycle time at a specific length; D/sub c-cross/. Here tentatively, interconnects shorter than D/sub c-cross/ are called local interconnects, and interconnects longer than that as global ones. The cross-sectional structures for local and global tiers are optimized separately. We also calculate global interconnect pitch and the chip size enlarged by the global interconnect pitch and the inserted repeaters, and then estimate the effectiveness of introducing new materials for interconnects and dielectrics.