A review of the skin effect as applied to thin film interconnections
A review of the skin effect as applied to thin film interconnections
复制标题
DOI：
10.1109/33.124191
复制
发表时间：
1992-02
期刊：
影响因子：
--
通讯作者：
L. Hwang;I. Turlik
中科院分区：
文献类型：
--
作者：
L. Hwang;I. Turlik
随着数字脉冲的上升时间减小到亚纳秒范围，集肤效应成为高速数字系统中的一个重要问题。综述了研究集肤效应的各种方法(理论和实验)。对将集肤效应现象纳入高速数字系统导体设计规则的各种方法进行了研究和比较。讨论了这些适应对高性能ULSI/VLSI多芯片封装的影响。>；
As the rise time of digital pulses is reduced to the subnanosecond range, the skin effect becomes an important issue in high-speed digital systems. The various approaches (theoretical and experimental) which have been taken to study the skin effect are surveyed. Various methods that accommodate the skin effect phenomenon into conductor design rules for high-speed digital systems are examined and compared. The resulting impact of these accommodations on high performance ULSI/VLSI multichip packages is addressed. >