Significant Die-Shift Reduction and μLED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics
Significant Die-Shift Reduction and μLED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics
复制标题
基于芯片优先扇出晶圆级封装的柔性混合电子器件显着减少芯片移位并实现 μLED 集成
DOI：
10.1109/tcpmt.2020.3009640
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发表时间：
2020
期刊：
影响因子：
--
通讯作者：
and Tetsu Tanaka,
中科院分区：
文献类型：
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作者：
Takafumi Fukushima ;Yuki Susumago;Zhengyang Qian;Chidai Shima;Bang Du;Noriyuki Takahashi;Shuta Nagata;Tomo Odashima;Hisashi Kino;and Tetsu Tanaka,
典型的管芯移位超过几十微米或更大，这是先进扇出晶圆级封装（FOWLP）上的严重问题，从而在用于细间距重新分布布线层（RDL）形成的后续光刻工艺中产生不可避免的未对准误差。特别是，预计这个问题在小芯片和边长小于1毫米的微小芯片中会变得更加严重。在这项工作中，提出使用锚定层将这些模具/小芯片固定在双面层压热释放带上，并大大减少模具移位。此外，作为柔性混合电子器件（FHE）一部分的甲上光电容积描记（PPG）传感器模块基于芯片优先FOWLP方法与μLED（270 μm × 270 μm）集成，使用生物相容性聚二甲基硅氧烷（PDMS）模塑树脂实时监测脉搏波和经皮血氧饱和度（SpO 2）。表征了形成在PDMS上的扇出Au布线的重复弯曲性以及μLED在芯片嵌入PDMS之前和之后的电流-电压（I-V）行为。
Typical die shift is beyond several tens micrometers or more, which is a serious problem on advanced fan-out wafer-level packaging (FOWLP), to give inevitable misalignment errors in the subsequent photolithography processes for fine-pitch redistributed wiring layer (RDL) formation. In particular, this problem is expected to grow all the more serious in chiplets and tiny dies less than 1 mm in a side. In this work, the use of an anchoring layer is proposed to fix these dies/chiplets on a double-side laminate thermo-release tape and drastically reduce the die shift. In addition, an on-nail photoplethysmogram (PPG) sensor module as a part of flexible hybrid electronics (FHE) is integrated with μLED (270 μm × 270 μm) based on a die-first FOWLP methodology using a biocompatible polydimethylsiloxane (PDMS) mold resin for realtime monitoring pulse wave and percutaneous oxygen saturation (SpO2). The repeated bendability of fan-out Au wirings formed on the PDMS and the current-voltage (I-V) behavior of the μLED before and after die embedment in the PDMS is characterized.