Shaping Organic Microcrystals Using Focused Ion Beam Milling
Shaping Organic Microcrystals Using Focused Ion Beam Milling
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DOI：
10.1021/acs.cgd.9b01327
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发表时间：
2020-03-01
影响因子：
3.8
通讯作者：
Bardeen, Christopher J.
中科院分区：
文献类型：
--
作者：
Li, Wangxiang;van Baren, Jeremiah;Bardeen, Christopher J.
聚焦离子束（FIB）铣削技术用于将二维形状切割成有机半导体分子苝组成的单晶。超薄金涂层的使用及其使用KI/I-2蚀刻溶液的去除允许晶体在FIB设备中成像，同时保护其免受电子束损伤。使用这种方法，可以创建空间分辨率为130 nm的特征，同时保留周围晶体区域90%的原始光致发光强度。这些原理验证实验表明，FIB铣削可以提供一种控制有机分子晶体纳米级形貌的通用方法。
The technique of focused ion beam (FIB) milling is used to cut two-dimensional shapes into single crystals composed of the organic semiconductor molecule perylene. The use of an ultrathin Au coating and its removal using a KI/I-2 etchant solution allow the crystal to be imaged in the FIB apparatus while protecting it from electron beam damage. Using this approach, features with a spatial resolution on the order of 130 nm can be created while retaining 90% of the original photoluminescence intensity in the surrounding crystal regions. These proof-of-principle experiments demonstrate that FIB milling could provide a general way to control the nanoscale morphology of organic molecular crystals.