The Effect of Crystallographic Orientation on the Mechanical Behavior of Cu6Sn5 by Micropillar Compression Testing
The Effect of Crystallographic Orientation on the Mechanical Behavior of Cu6Sn5 by Micropillar Compression Testing
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DOI：
10.1007/s11664-012-2124-4
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发表时间：
2012-05
影响因子：
2.1
通讯作者：
Ling Jiang;Hanqing Jiang;N. Chawla
中科院分区：
文献类型：
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作者：
Ling Jiang;Hanqing Jiang;N. Chawla
采用纳米压入和微压柱试验研究了单晶Cu6Sn5的微力学行为的各向异性。利用电子背散射衍射技术研究了Cu_6Sn_5结核的晶体学取向和织构。取向成像的表征结果表明，虽然在几个晶粒中存在一定程度的偏离，但结核的生长方向与Cu_6Sn_5的晶胞轴方向一致。垂直于生长轴的方向是随机的，表明纤维结构。机械性能表明，相对于垂直于轴，靠近轴的强度增加20%，杨氏模量增加7%。仔细分析结果的基础上的角度轴显示了线性下降的强度与增加偏离轴。我们的研究结果将有助于理解和断裂建模下的热和机械载荷条件下的Cu6Sn5。
The anisotropy of the micromechanical behavior of single-crystal Cu6Sn5was studied by nanoindentation and microcompression testing of pillars. Electron backscattered diffraction was employed to determine the crystallographic orientation and texture of Cu6Sn5nodules. Characterization results from orientation imaging mapping show that the growth direction of the nodules is somewhat aligned to thec-axis of the unit cell of Cu6Sn5, although a fair amount of deviation exists in several grains. Normal to the growth axis the orientation is random, indicating a fiber texture. The mechanical properties indicate a 20% increase in strength and 7% increase in Young’s modulus close to thec-axis relative to normal to thec-axis. Careful analysis of the results based on angle to thec-axis shows a linear decrease in strength with increasing deviation from thec-axis. Our results should help understanding and fracture modeling of Cu6Sn5under thermal and mechanical loading conditions.