A New Methodology to Protect PCBs from Non-destructive Reverse Engineering
A New Methodology to Protect PCBs from Non-destructive Reverse Engineering
复制标题
保护 PCB 免受无损逆向工程影响的新方法
DOI：
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发表时间：
2016
期刊：
影响因子：
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通讯作者：
Navid Asadizanjani
中科院分区：
文献类型：
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作者：
Navid Asadizanjani
电子硬件的逆向工程已经进行了几十年，用于两个广泛的目的：（1）用于故障分析和信任验证的诚实和法律的手段;以及（2）克隆、伪造和开发对硬件的攻击以获得市场竞争优势的不诚实和非法手段。破坏性方法通常被认为是对印刷电路板（PCB）进行逆向工程的最有效方法-几乎所有电子系统都使用PCB平台来机械支撑和电气连接所有硬件组件。然而，先进的表征和成像工具（如X射线断层扫描）的出现使电子逆向工程转向非破坏性方法。这些方法大大降低了对复杂多层PCB进行逆向工程的相关时间和成本。在本文中，我们介绍了一种新的反逆向工程方法，以保护印刷电路板的无损逆向工程。我们在PCB内部添加高Z材料并开发先进的布局算法，这些算法在断层扫描过程中会产生不可避免的成像伪影，从而使对手无法通过X射线断层扫描提取正确的设计信息。
Reverse engineering of electronic hardware has been performed for decades for two broad purposes: (1) honest and legal means for failure analysis and trust verification; and (2) dishonest and illegal means of cloning, counterfeiting, and development of attacks on hardware to gain competitive edge in a market. Destructive methods have been typically considered most effective to reverse engineer Printed Circuit Boards (PCBs) – a platform used in nearly all electronic systems to mechanically support and electrically connect all hardware components. However, the advent of advanced characterization and imaging tools such as X-ray tomography has shifted the reverse engineering of electronics toward non-destructive methods. These methods considerably lower the associated time and cost to reverse engineer a complex multi-layer PCB. In this paper, we introduce a new anti–reverse engineering method to protect PCBs from nondestructive reverse engineering. We add high-Z materials inside PCBs and develop advanced layout algorithms, which create inevitable imaging artifacts during tomography, thereby making it practically infeasible for an adversary to extract correct design information with X-ray tomography.