Reliability Considerations for Oil Immersion-Cooled Data Centers
Reliability Considerations for Oil Immersion-Cooled Data Centers
复制标题
油浸冷却数据中心的可靠性注意事项
DOI:
10.1115/1.4042979
复制
发表时间:
2019
影响因子:
1.6
通讯作者:
Mulay, Veerendra
中科院分区:
文献类型:
--
作者:
Shah, Jimil M.;Eiland, Richard;Rajmane, Pavan;Siddarth, Ashwin;Agonafer, Dereje;Mulay, Veerendra
The improved efficiency of mineral oil may offer simplicity in facility design compared to traditional air cooling and provide a means for cost savings. Despite its improved cooling efficiency and cost savings, a mineral oil immersion cooling technique is still not widely implemented and original equipment manufacturers are reluctant to jeopardize sales of existing air-based cooling system equipment. Only compelling physics regarding thermal performance of direct immersion cooling is not enough for data center operators. Many uncertainties and concerns persist regarding the effects of mineral oil immersion cooling on the reliability of information technology (IT) equipment both at the component and chassis level. This paper is a first attempt at addressing this challenge by reviewing the changes in physical and chemical properties of IT equipment materials like polyvinyl chloride (PVC), printed circuit board (PCB), and capacitors and characterizes the interconnect reliability of materials. The changes in properties of a mineral oil like kinematic viscosity and dielectric strength are also cited as important factors and discussed briefly. The changes in mechanical properties like elasticity, hardness, swelling, and creep are being shown in the paper for thermoplastic materials. The chemical reaction between material and mineral oil as a function of time and temperature is also conferred. The literature gathered on the subject and quantifiable data gathered by the authors provide the primary basis for this research document.
登录
查看更多内容
影响因子:
1.8
作者:
F. M. Clark
通讯作者:
F. M. Clark
DOI:
--
发表时间:
2010
期刊:
影响因子:
--
作者:
E. Yuliastuti
通讯作者:
E. Yuliastuti
影响因子:
1.6
作者:
Jimil M. Shah;Oluwaseun Awe;Pavan K. Agarwal;Iziren Akhigbe;D. Agonafer;Prabjit Singh;N. Kannan;M. Kaler
通讯作者:
M. Kaler
DOI:
--
发表时间:
2015
期刊:
影响因子:
--
作者:
R. Eiland
通讯作者:
R. Eiland
DOI:
--
发表时间:
2017
期刊:
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
影响因子:
--
作者:
Pavan Rajmane;Hassaan Ahmad Khan;A. Doiphode;Unique Rahangdale;D. Agonafer;A. Lohia;S. Kummerl;L. Nguyen
通讯作者:
L. Nguyen