Photonic topology optimization with semiconductor-foundry design-rule constraints
Photonic topology optimization with semiconductor-foundry design-rule constraints
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DOI：
10.1364/oe.431188
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发表时间：
2021-07-19
期刊：
影响因子：
3.8
通讯作者：
Ralph, Stephen E.
中科院分区：
文献类型：
--
作者：
Hammond, Alec M.;Oskooi, Ardavan;Ralph, Stephen E.
我们提出了一个统一的基于密度的拓扑优化框架，产生集成的光子设计优化的制造限制，包括所有的商业半导体代工厂。我们引入了一种新的方法来施加最小面积和最小封闭面积的限制，同时适应以前的技术，最小线宽，线间距和曲率，所有这些都没有任何额外的重新参数化。此外，我们展示了如何微分形态变换可以用来生产设备，是强大的过/欠蚀刻，同时也满足制造限制。我们展示了我们的方法，设计三个宽带硅光子器件的九个不同的铸造约束组合。(C)根据OSA开放获取出版协议的条款，2021年美国光学学会
We present a unified density-based topology-optimization framework that yields integrated photonic designs optimized for manufacturing constraints including all those of commercial semiconductor foundries. We introduce a new method to impose minimum-area and minimum-enclosed-area constraints, and simultaneously adapt previous techniques for minimum linewidth, linespacing, and curvature, all of which are implemented without any additional re-parameterizations. Furthermore, we show how differentiable morphological transforms can be used to produce devices that are robust to over/under-etching while also satisfying manufacturing constraints. We demonstrate our methodology by designing three broadband silicon-photonics devices for nine different foundry-constraint combinations. (C) 2021 Optical Society of America under the terms of the OSA Open Access Publishing Agreement