Thermomechanics of solids with general imperfect coherent interfaces

Thermomechanics of solids with general imperfect coherent interfaces
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具有一般不完美相干界面的固体的热力学

DOI:
10.1007/s00419-014-0870-x
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发表时间:
2014
影响因子:
2.8
通讯作者:
amd Steinmann
amd Steinmann
中科院分区:
工程技术4区
文献类型:
--
作者:
Kaessmair;Javili;amd Steinmann

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这一贡献的目的是针对一般不完善的共格界面的热力学行为,发展一个热力学一致性理论,并建立一个统一的计算框架,用有限元方法模拟所有这类界面。传统上,在热行为方面不完美的界面通常被限制为高导电(HC)或低导电(LC),也称为Kapitza。这里的界面模型通常是不完美的,因为它允许温度的跃升以及正常热流通过界面的跃变。显然,在极端情况下,当前模型简化为HC和LC接口。一般非理想界面的一个新特征是,界面温度是一个独立的自由度,通常不只是界面温度的函数。然而,界面温度必须使用一个新的界面材料参数,即灵敏度来计算。结果表明,根据第二定律,界面温度不一定是界面温度的平均值,甚至不一定是界面温度之间的平均值。具体地说,即使界面上的温度跳跃消失,界面温度也可能与界面上的温度不同。这一发现使我们能够更好地理解HC界面,而且有些新奇。也就是说,HC界面意味着(但不是暗示)界面上的温度跳跃消失。该问题的表述使得所有类型的界面都是由一个一般的不完美界面模型导出的,因此,我们建立了一个统一的有限元框架来模拟一般暂态问题的所有类型的界面。给出了新的数值格式的全部细节。然后通过一系列三维数值例子阐明了该问题的主要特征。最后,我们回忆起,由于界面对物体整体响应的影响随着问题规模的减小而增加,这一贡献在纳米复合材料和热界面材料中也有一定的应用。
The objective of this contribution is to develop a thermodynamically consistent theory for general imperfect coherent interfaces in view of their thermomechanical behavior and to establish a unified computational framework to model all classes of such interfaces using the finite element method. Conventionally, imperfect interfaces with respect to their thermal behavior are often restricted to being either highly conducting (HC) or lowly conducting (LC) also known as Kapitza. The interface model here is general imperfect in the sense that it allows for a jump of the temperature as well as for a jump of the normal heat flux across the interface. Clearly, in extreme cases, the current model simplifies to HC and LC interfaces. A new characteristic of the general imperfect interface is that the interface temperature is an independent degree of freedom and, in general, is not a function of only temperatures across the interface. The interface temperature, however, must be computed using a new interface material parameter, i.e., thesensitivity. It is shown that according to the second law, the interface temperature may not necessarily be the average of (or even between) the temperatures across the interface. In particular, even if the temperature jump at the interface vanishes, the interface temperature may be different from the temperatures across the interface. This finding allows for a better, and somewhat novel, understanding of HC interfaces. That is,a HC interface implies, but is not implied by, the vanishing temperature jump across the interface. The problem is formulated such that all types of interfaces are derived from a general imperfect interface model, and therefore, we establish a unified finite element framework to model all classes of interfaces for general transient problems. Full details of the novel numerical scheme are provided. Key features of the problem are then elucidated via a series of three-dimensional numerical examples. Finally, we recall since the influence of interfaces on the overall response of a body increases as the scale of the problem decreases, this contribution has certain applications to nano-composites and also thermal interface materials.
DOI: 10.1103/physrevb.44.1266
发表时间: 1991
期刊: Physical review. B, Condensed matter
影响因子: --
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影响因子: 6.6
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DOI: 10.1007/s00466-013-0862-7
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连续介质力学中的虚拟力方法应用于呈现奇异表面和界面的介质
DOI: 10.1007/bf01176354
发表时间: 1986
期刊: Acta Mechanica
影响因子: 2.7
作者:
N. Daher;G. Maugin
通讯作者: G. Maugin