Selective crack suppression during deformation in metal films on polymer substrates using electron beam irradiation
Selective crack suppression during deformation in metal films on polymer substrates using electron beam irradiation
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DOI：
10.1038/s41467-019-12451-8
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发表时间：
2019-10
影响因子：
16.6
通讯作者：
So-Yeon Lee;Kyung Ryoul Park;Sung-gyu Kang;Jihoon Lee;Eun-chae Jeon;Cheol-Hwee Shim;Jae-pyoung Ahn
中科院分区：
文献类型：
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作者：
So-Yeon Lee;Kyung Ryoul Park;Sung-gyu Kang;Jihoon Lee;Eun-chae Jeon;Cheol-Hwee Shim;Jae-pyoung Ahn
虽然裂纹通常被认为是有害的，但裂纹的产生可以用于各种应用，例如在陶瓷材料中，通过引导裂纹扩展和裂纹张开。在这里，我们发现，电子束照射提示在聚酰亚胺基板上的铜（Cu）薄膜中的裂纹抑制现象，允许控制裂纹形成的位置和形状。在拉伸应变下，在Cu膜的未照射区域上形成裂纹，而在照射区域上防止裂纹。我们将此归因于通过Cu膜传输的电子在Cu-聚酰亚胺界面处的粘附力的增强。最后，我们选择性地在聚酰亚胺衬底上的铜膜中形成导电区域，并在张力下制备应变响应有机发光器件。
While cracks are usually considered detrimental, crack generation can be harnessed for various applications, for example in ceramic materials, via directing crack propagation and crack opening. Here, we find that electron beam irradiation prompts a crack suppression phenomenon in a copper (Cu) thin film on a polyimide substrate, allowing for the control of crack formation in terms of both location and shape. Under tensile strain, cracks form on the unirradiated region of the Cu film whereas cracks are prevented on the irradiated region. We attribute this to the enhancement of the adhesion at the Cu–polyimide interface by electrons transmitted through the Cu film. Finally, we selectively form conductive regions in a Cu film on a polyimide substrate under tension and fabricate a strain-responsive organic light-emitting device.