Copper thin films deposited under different power delivery modes and magnetron configurations: A comparative study
Copper thin films deposited under different power delivery modes and magnetron configurations: A comparative study
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DOI：
10.1016/j.surfcoat.2016.11.001
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发表时间：
2017-10
影响因子：
5.4
通讯作者：
Ioana-Laura Velicu;V. Tiron;B. Rusu;G. Popa
中科院分区：
文献类型：
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作者：
Ioana-Laura Velicu;V. Tiron;B. Rusu;G. Popa
本研究调查了拓扑、结构、机械（硬度和杨氏模量）和摩擦学性能研究了采用常规直流磁控溅射（dcMS）和单脉冲（3 μs）HiPIMS技术在硅和石墨衬底上沉积的具有纳米晶结构、表面光滑均匀、厚度为800 nm的铜（Cu）薄膜的临界载荷和摩擦系数特性，分别在不存在和存在附加磁场的情况下。以这种短脉冲操作HiPIMS放电优化了沉积速率并提供了更高比例的离子化金属通量，而附加磁场的存在促进了带电粒子向基板的传输，从而导致更高的沉积速率。沉积的薄膜的密度通过使用卢瑟福背散射光谱法测量面原子密度和通过截面扫描电子显微镜测量膜厚度来获得。纳米压痕的结果进行了初步分析，使用的Oliver-Pharr方法，然后，为了纠正堆积误差，其他方法已被采用。与其他样品相比，主要是由于在生长过程中的高能轰击和强烈的表面扩散，使用HiPIMS沉积的铜薄膜辅助由一个额外的磁场表现出显着更光滑的表面，更高的结晶度，更致密的微观结构，更高的硬度和杨氏模量，和更低的摩擦系数。
This study investigated the topological, structural, mechanical (hardness and Young's modulus) and tribological (critical loads and coefficient of friction) properties of copper (Cu) thin films with nanocrystalline structure, smooth and uniform surfaces and thickness of 800 nm, deposited on silicon and graphite substrates by conventional dc magnetron sputtering (dcMS) and HiPIMS operated with single ultra-short pulses (3 μs), in the absence and presence, respectively, of an additional magnetic field. Operating the HiPIMS discharge with such short pulses optimizes the deposition rate and provides a higher fraction of ionized metal flux, while the presence of the additional magnetic field facilitates the transport of charged particles towards the substrate, leading to a higher deposition rate. The density of the deposited thin films was obtained by measuring the areal atomic density using Rutherford backscattering spectrometry and the film thickness by cross-sectional scanning electron microscopy. The nanoindentation results were initially analyzed using the Oliver-Pharr method, and then, in order to correct de pile-up errors, other methods have been employed. Compared to the other samples, mainly due to the high energetic bombardment during the growing process and intense surface diffusion, the Cu thin films deposited using HiPIMS assisted by an additional magnetic field exhibit significantly smoother surfaces, higher crystallinity, denser microstructure, higher hardness and Young's modulus, and lower coefficient of friction.