Mechanical properties of composite materials with integrated embedded sensor networks
Mechanical properties of composite materials with integrated embedded sensor networks
复制标题
具有集成嵌入式传感器网络的复合材料的机械性能
DOI：
--
复制
发表时间：
2005
期刊：
影响因子：
--
通讯作者：
S. Nemat
中科院分区：
文献类型：
--
作者：
Kristin Schaaf;B. Cook;F. Ghezzo;A. Starr;S. Nemat
我们提出了开发结构复合材料的努力，其中包括具有决策能力的嵌入式传感器网络，以扩展复合材料的功能以实现信息感知。下一代结构系统将包括获取、处理结构信息或其他类型信息的能力，并在必要时对结构或其他类型的信息做出响应。我们介绍了在玻璃钢等结构复合材料中嵌入微型电子微传感器阵列的相关工作。虽然这种器件的尺寸和功耗在增加功能的同时不断降低，但相对于增强纤维的典型尺寸和层间距，这些器件的尺寸仍然很大。因此，这些设备对各种机械性能的影响的问题是相关的和重要的。我们介绍了在特定系统中描述其中一些影响的工作，在这些系统中，传感器或合适的虚拟传感器以大约1厘米的元件间距排列。微电子传感元件的典型尺寸为~1 mm，这里为正交形。尤其重要的是这种器件的夹杂对基础复合材料的强度或疲劳性能的影响。我们的工作旨在描述层合复合材料中垂直于厚度方向的一维和二维阵列的这些效应。我们还试图隔离由于代表嵌入式网络的电力承载和数据通信能力的传感元件和所需的互连而产生的影响。
We present efforts to develop structural composite materials which include networks of embedded sensors with decision-making capabilities that extend the functionality of the composite materials to be information-aware. The next generation of structural systems will include the capability to acquire, process, and if necessary respond to structural or other types of information. We present work related to the development of embedded arrays of miniature electronic-based microsensors within a structural composite materials, such as GFRP. Although the scale and power consumption of such devices continues to decrease while increasing the functionality, the size of these devices remain large relative the typical scale of the reinforcing fibers and the interlayer spacing. Therefore, the question of the impact of those devices on the various mechanical properties is relevant and important. We present work on characterizing some of those effects in specific systems where sensors, or suitable dummy sensors, are arrayed with ~1 cm spacing between elements. The typical size of the microelectronic sensing element is ~1 mm, and here is orthorhombic. Of particular importance are the effects of inclusion of such devices on strength or fatigue properties of the base composite. Our work seeks to characterize these effects for 1 and 2 dimensional arrays lying in planes normal to the thickness direction in laminated composites. We also seek to isolate the effects due to the sensing elements and the required interconnections that represent the power-carrying and data communications capabilities of the embedded network.