Supply Chain Hardware Integrity for Electronics Defense (SHIELD) Using Small “Dielets”
Supply Chain Hardware Integrity for Electronics Defense (SHIELD) Using Small “Dielets”
复制标题
使用小型“Dielet”实现电子防御 (SHIELD) 供应链硬件完整性
DOI：
10.4071/isom-2017-thp21_112
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发表时间：
2017
影响因子：
2.9
通讯作者：
Nathanael Ellerhoff
中科院分区：
文献类型：
--
作者：
L. Chorosinski;V. Sundaram;K. Wolter;R. Calatayud;Parrish Ralston;S. Suko;David Fry;Nathanael Ellerhoff
摘要 在 DARPA/MTO SHIELD 计划下，诺斯罗普·格鲁曼公司领导的团队正在开发一种供应链可追溯性和认证方法，以防范日益增长的假冒电子零件威胁。我们的 SHIELD 解决方案的基础是采用 14nm CMOS 制造的先进 100μm × 100μm × 20μm 近场 RFID“芯片”。该小芯片将嵌入主机组件的封装中，并通过集成先进的密钥保护和加密技术来提供硬件信任根。在主机组件的整个生命周期中，可以使用射频探针为dielet供电并与dielet通信，执行密码质询并向集中式安全服务器和SHIELD真实性数据库提供响应来验证真实性。本文概述了芯片设计、封装和主机组件插入。这项研究是在 DARPA 的资助下开展的。所表达的观点、意见和/或发现是作者的观点、意见和/或发现......
Abstract Under the DARPA/MTO SHIELD program, a Northrop Grumman led team is developing a supply chain traceability and authentication method to protect against the growing threat of counterfeit electronic parts. The foundation of our SHIELD solution is an advanced 100μm × 100μm × 20μm near-field RFID “dielet” fabricated on 14nm CMOS. This dielet will be embedded in a host component's packaging and provides a hardware root-of-trust through the integration of advanced key protection and cryptographic techniques. Throughout the life-cycle of the host component, the authenticity can be verified using an RF probe to energize and communicate with the dielet, performing a cryptographic challenge and providing a response to a centralized secure server and SHIELD authenticity database. This paper provides a general overview of the dielet design, packaging, and host component insertion. This research was developed with funding from the DARPA. The views, opinions and/or findings expressed are those of the author and...