Numerical investigation of flow boiling in manifold microchannel-based heat exchangers
Numerical investigation of flow boiling in manifold microchannel-based heat exchangers
复制标题
基于歧管微通道的换热器流动沸腾的数值研究
DOI：
10.1016/j.ijheatmasstransfer.2020.120493
复制
发表时间：
2020-12
影响因子：
5.2
通讯作者：
Wei Yao
中科院分区：
文献类型：
--
作者：
Wenyuan Xie;Xiaochen Lv;Dachuan Liu;Long Li;Wei Yao
微通道热沉具有达到相变传热物理极限的潜力。近年来，随着纳米/微米尺度制造技术的发展，微通道换热器的研究取得了重要进展。然而，微尺度下两相流动的演变及其对流动沸腾的影响仍然不清楚。为了更好地理解和优化微通道热沉，需要对微通道内的输运过程及其机理进行详细的研究。本文构建了一个三维多支管微通道换热器模型，采用相场法研究了其两相流态和传热性能。研究了在雷诺数和热边界条件下，深度分别为80 μm、150 μm和300 μm的微通道内汽泡的动力学行为。系统地分析了影响歧管微通道内两相流动和传热性能的参数和机理。最后，研究了微通道内传热危机和临界热流密度（CHF）的产生机理，并探讨了流场优化以延缓CHF发生的策略。我们的研究提供了详细的信息在微尺度上的传输过程，并提供了下一代微尺度散热器的设计和制造的机会。
Microchannel heat sinks have the potential to achieve the physical limit of phase change heat transfer. With advances in nano-/microscale fabrication techniques, important progress on microchannel heat exchangers has been made in recent years. However, the two-phase flow evolution and its influence on flow boiling at microscale remains ambiguous. Detailed information on transport process in microchannel and underlying mechanism are required for the fully understanding and further optimization of the microchannel heat sink. Here, we constructed a three-dimensional manifold microchannel-based heat exchanger model to study the two-phase flow pattern and heat transfer performance using the Phase-field method. The dynamics of vapor bubbles in microchannels of 80 μm, 150 μm, and 300 μm in depth was carefully investigated with respect to Reynolds number and thermal boundary conditions. Parameters and underlying mechanism that influence the two-phase flow evolution and heat transfer performance in the manifold microchannels are systematically analyzed. Finally, mechanism of heat transfer crisis and critical heat flux (CHF) in microchannel is studied, and strategies to optimize the flow field to delay the CHF are discussed. Our study provides detailed information on the transport process at microscale and offers opportunities for the design and fabrication of next generation microscale heat sinks.
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影响因子：
--
作者：
C. Kuo;Y. Peles
通讯作者：
C. Kuo;Y. Peles
影响因子：
29.4
作者：
Li, Wenming;Wang, Zuankai;Li, Chen
通讯作者：
Li, Chen
DOI：
10.1109/stherm.1991.152913
发表时间：
1991-02
期刊：
1991 Proceedings, Seventh IEEE Semiconductor Thermal Measurement and Management Symposium
影响因子：
--
作者：
G. Harpole;J. Eninger
通讯作者：
G. Harpole;J. Eninger
影响因子：
--
作者：
Tailian Chen;S. Garimella
通讯作者：
Tailian Chen;S. Garimella
影响因子：
10.8
作者：
Li, D.;Wu, G. S.;Yang, Ronggui
通讯作者：
Yang, Ronggui